- Improved solder joint reliability compared with conventional CEM-3 which has already good to safety and long-time reliability property.
Contribute to high reliability PCB for electric car.
Circuit Board Materials
- Part Number
Double-sided
copper clad
R-1785
- Application
- Detailed use
・Automotive
・Appliance
・Appliance
Automotive component, Power supply board, Power device module board, Infrastructure(Smart meter, IC tag), etc.
Press Release
Properties
CTE x,y-axis
20ppm/℃
20ppm/℃
Tg (TMA)
150℃
150℃
CTI≧600V
Solder joint reliability
CAF resistance
General properties
Item | Test method | Condition | Unit | R-1785 | Our conventional CEM-3 |
Our conventional FR-4 |
|
Glass transition temp. (Tg) | TMA | Temp. rising rate: 10°C/min | °C | 150 | 140 | 140 | |
Solder heat resistance | JIS C 6481 | A 260°C solder float for 2min |
– | No abnormality | No abnormality | No abnormality | |
CTE x-axis | α1 | IPC-TM-650 2.4.41 | TMA | ppm/°C | 19 (15) | 25 (20) | 13 |
CTE y-axis | 21 (17) | 28 (23) | 15 | ||||
CTE z-axis | α1 | IPC-TM-650 2.4.24 | TMA | ppm/°C | 50 | 65 | 65 |
Dielectric constant (Dk) | 1MHz | IPC-TM-650 2.2.2.9 | C-24/23/50 | - | 4.2 | 4.2* | (4.6) |
1GHz | 4.0 | 4.0 | (4.3) | ||||
Dissipation factor (Df) | 1MHz | 0.023 | 0.011* | (0.014) | |||
1GHz | 0.010 | 0.007 | (0.016) | ||||
Insulation resistance | JIS C 6481 | C-96/20/65 | MΩ | 5×10⁸ | 5×10⁸ | 1×10⁸ | |
Tracking resistance | IEC 60112 | A | V | CTI≥600 | CTI≥600 | 250>CTI≥175 | |
Accuracy of thickness (σ value) | – | A | mm | 0.013 | 0.013 | 0.027 |
The sample thickness is 1.6mm.
The figure in parentheses is for the thickness of 0.8mm.
* Test method and condition are in accordance with JIS C6481, C-96/20/65.
The above data are typical values and not guaranteed values.