High elasticity Low CTE Ultra-thin IC substrate materials | R-1515E

Ultra-thin circuit board materials MEGTRON GX R-1515E

 

  1. Contribute to thin IC package by ultra-thin material and decrease the substrate warpage by low CTE property

Circuit Board Materials

  • Part Number

Laminate R-1515E
Prepreg R-1410E

  • Application
Mobile
IC substrate
 

Properties

Flexural modulus
25°C 33GPa
CTE x, y-axis
8-10ppm/°C
Tg (DMA)
270°C

Package warpage(FBGA)

PKG warpage (FBGA)

Thermal expansion(x-axis)

Cross section (SEM observation)

General properties

Item Test method Condition Unit MEGTRON GX
R-1515E
Glass transition temp.(Tg) DMA A °C 270
Thermal decomposition temp.(Td) TGA A °C 390
T260 (with copper)  IPC-TM-650 2.4.24.1 A min >120
T288 (with copper)  IPC-TM-650 2.4.24.1 A min >120
CTE x-axis α1 Internal method A ppm/°C 8-10
CTE y-axis 8-10
CTE z-axis* α1 IPC-TM-650 2.4.24 A 22
α2 95
Dielectric constant(Dk)* 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.7
Dissipation factor(Df)* 0.011
Volume resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ·cm 1×109
Surface resistivity 1×108
Water absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.3
Flexural modulus* JIS C 6481 25°C GPa 33
250°C 18
Peel strength 1/3oz(12μm) IPC-TM-650 2.4.8 A kN/m 0.9

The sample thickness is 0.1 mm.
* 0.8mm

The above data are typical values and not guaranteed values.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)