Products for Automotive components

Millimeter-wave radar

Antenna board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials Laminate : R-5515
Prepreg : R-5410
  • Dk 3.0 Df 0.002@10GHz
  • Tg (DMA) 200℃
  • Reduce PCB process cost
    (vs. PTFE material)
Circuit Board Materials
Circuit Board Materials
Ultra-low transmission loss multi-layer circuit board materials MEGTRON7 Laminate : R-5785(N)
Prepreg : R-5680(N)
  • High speed & ultra-low transmission loss
  • High reliability
  • Lead-free soldering
Circuit Board Materials
Circuit Board Materials
Ultra-low transmission loss multi-layer circuit board materials MEGTRON6 Laminate :
R-5775, R-5775(N)
Prepreg :
R-5670, R-5670(N)
  • High speed & ultra-low transmission loss
  • High reliability
  • Lead-free soldering
Circuit Board Materials
Circuit Board Materials
LCP flexible circuit board materials FELIOS LCP Double-sided copper clad : R-F705S
  • Low transmission loss
  • High frequency characteristics
  • Moisture resistance
Control board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Low transmission loss multi-layer materials MEGTRON4S
MEGTRON4
Laminate :
R-5725S, R-5725
Prepreg :
R-5620S, R-5620
  • High speed & low transmission loss
  • High reliability
  • Lead-free soldering
Circuit Board Materials
Circuit Board Materials
Low transmission loss multi-layer materials MEGTRON M Laminate : R-5735
Prepreg : R-5630
  • High speed & low transmission loss
  • High reliability
  • Lead-free soldering
Circuit Board Materials
Circuit Board Materials
Low transmission loss multi-layer materials Halogen-free MEGTRON2 Laminate : R-1577
Prepreg : R-1570
  • High speed & low transmission loss
  • High heat resistance
  • Halogen free
Circuit Board Materials
Circuit Board Materials
High heat resistance (High-Tg) multi-layer circuit board materials HIPER V Laminate : R-1755V
Prepreg : R-1650V
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials
Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)

Electronic Control Unit

Main board (in the engine room)
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
High heat resistance (High-Tg) multi-layer circuit board materials HIPER D Laminate : R-1755D
Prepreg : R-1650D
  • High heat resistance
  • High reliability
  • High reliability of solder connection
Circuit Board Materials
Circuit Board Materials
High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M Laminate : R-1755M
Prepreg : R-1650M
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials
High heat resistance multi-layer circuit board materials HIPER E Laminate : R-1755E
Prepreg : R-1650E
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials
Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials
Mass laminations(Shield board) PreMulti -
  • High multi-layered ~24 layers
  • AOI inspection for all materials
  • Quick delivery
Main board (in the vehicles cabins)
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
High heat resistance multi-layer circuit board materials HIPER E Laminate : R-1755E
Prepreg : R-1650E
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials
Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials
Multi-layer circuit board materials Laminate : R-1766
Prepreg : R-1661
  • Multilayer molding processability
  • Excellent laminate processability
  • Dimensional stability
Circuit Board Materials
Circuit Board Materials
Mass laminations(Shield board) PreMulti -
  • High multi-layered ~24 layers
  • AOI inspection for all materials
  • Quick delivery

In-vehicle autonomous driving server

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials Halogen-free Laminate : R-A555(W)
Prepreg : R-A550(W)
  • Dk 3.4 @2GHz (Resin content 70wt%)
  • CTE z-axis 41ppm/°C
  • Tg(DMA) 200°C

Headlight

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
High thermal conductive glass composite circuit board materials ECOOL 1.1W/m・K : R-1787
  • High heat dissipation
  • Tracking resistance
  • High reliability

GPS navigation, Control panel

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Touch panel
Product category Product name Product number Features / Proposals
Advanced Films
Advanced Films
Anti-Glare Type Anti-Reflection Films MUAG8 (G202N)
  • Low Reflectance 0.5% (SCI)
  • Excellent Weatherability Conforming to the DIN 75220
  • High Infrared Ray Transmittance
Advanced Films
Advanced Films
Clear Type Anti-Reflection Films MUAR5 (C100N)
  • Cutting-Edge Low Reflectance
  • Neutral color
  • High Infrared Ray Transmittance
Advanced Films
Advanced Films
Moldable Low-Reflection Films GSP109A
  • 120-130% Stretchable
  • Chemical resistance,
    Anti-Fingerprint
  • Low-Reflection
Advanced Films
Advanced Films
Anti-Rainbow and Anti-Blackout Films MUAH4029
MUAH40J
  • Prevent Rainbows and Blackout
  • Effective when using polarized sunglasses
  • Fortified Surface with Anti-Fingerprint (MUAH40J)
HUD unit
Product category Product name Product number Features / Proposals
Advanced Films
Advanced Films
Thermal Insulation Optical Films MUAH6 (IRC104)
IRC102
  • Intercept 80% of Near-Infrared Lights
  • Project the Originally Generated Image As Is
  • Easy to Apply

Meter panel

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Glass composite circuit board materials Double-sided copper clad : R-1786
Single-sided copper clad : R-1781
  • Tracking resistance
  • High reliability
  • Size-free
Light diffusion / reflection board
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound
For LED (optical parts) light diffusion / reflection PP molding compounds FULL BRIGHT PP MBG105H
MBG130H
  • Light diffusion / reflection
  • UV resistance
  • Chemical resistance

Semiconductor Encapsulation, Surface Mount Assembly Reinforcement

Semiconductor Encapsulation
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
For Power modules high thermal conductive semiconductor encapsulation materials LEXCM CF CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
For high heat resistance power devices semiconductor encapsulation materials LEXCM CF CV8540 series
  • High heat resistance
  • Low warpage, Low stress
  • High insulation
Sidefill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
High heat resistance Secondary mounting Sidefill materials LEXCM AF CV5797 series
  • For large size PKG
  • Tg 160°C
  • Pot life: 72h
Underfill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
High heat resistance Secondary mounting Underfill materials LEXCM AF CV5794 series
  • Tg 160°C
  • Compatible with the PKG size up to 20 mm square
  • Pot life: 72h
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
Low-temperature curing Secondary mounting Underfill materials LEXCM AF CV5350AS
  • Cures at a low temp of 80°C
  • Tg is 140°C or greater
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
For secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM AF CV5313
CV5314
  • Drop impact resistance
  • Underfill/Sidefill reinforcement

Motor

Commutator
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound
High heat resistance phenolic molding compounds CN6641
CN6771
CY4200
  • High heat resistance
  • High strength
  • Dimensional stability
Alternator
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound
High heat dissipation unsaturated polyester resin molding compounds CE2830
  • High heat dissipation
  • Low pressure molding
  • Dimensional stability

Switching power supply

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Glass composite circuit board materials Double-sided copper clad : R-1786
Single-sided copper clad : R-1781
  • Tracking resistance
  • High reliability
  • Size-free

Wire Harness

Wire Harness
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Flexible circuit board materials FELIOS Standard type : R-F775
  • Spring back performance
  • Dimensional stability
  • High heat resistance

Electrical components, Structural components

Housing, Bushing
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound
High heat resistance phenolic molding compounds CN6641
CN6771
CY4200
  • High heat resistance
  • High strength
  • Dimensional stability
Switch, Sensor
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound
Long-term reliable PBT molding compounds MBS225
  • Long-term reliability
  • High heat resistance
  • Tracking resistance