Products for IC package - Electronic Materials - 파나소닉

Each application of IC package

BGA
FC-BGA
CSP
PoP, MUF
NCP, CUF
Surface Mount Assembly Reinforcement
Large encapsulation area
Module encapsulation

BGA

Encapsulation / Mounting

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	Capillary Underfill(CUF) Semiconductor encapsulation materials		CV5300 series	High fluidity for Narrow gap/pitch Reduced void/bleed

FC-BGA

Application processor

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Narrow pitch corresponding circuit board materials		Laminate : R-1515W Prepreg : R-1410W	High heat resistance Low CTE Mechanical drilling-ability
Circuit Board Materials	Narrow pitch corresponding circuit board materials		Laminate : R-1515A Prepreg : R-1410A	High heat resistance Mechanical drilling-ability Halogen-free

CSP

Memory

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Ultra-thin circuit board materials		Laminate : R-151YE, R-1515E Prepreg : R-141YE, R-1410E	Low warpage Corresponding to ultra-thin Halogen-free

Encapsulation / Mounting

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	Capillary Underfill(CUF) Semiconductor encapsulation materials		CV5300 series	High fluidity for Narrow gap/pitch Reduced void/bleed

PoP, MUF

Encapsulation / Mounting

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	Thin surface mounting semiconductor encapsulation materials		CV8710 CV8760	Thinner High-density wiring Warpage control

NCP, CUF

Encapsulation / Mounting

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	Capillary Underfill(CUF) Semiconductor encapsulation materials		CV5300 series	High fluidity for Narrow gap/pitch Reduced void/bleed

Surface Mount Assembly Reinforcement

Sidefill

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	High heat resistance Secondary mounting Sidefill materials		CV5797 series	For large size PKG Pot life: 72h

Underfill

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	High heat resistance Secondary mounting Underfill materials		CV5794 series	Compatible with the PKG size up to 20 mm square Pot life: 72h
Semiconductor Encapsulation Materials	Low-temperature curing Secondary mounting Underfill materials		CV5350 Series	High fluidity

Large encapsulation area

Encapsulation / Mounting

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	For SMD module low warpage liquid encapsulant		CV5386 CV5401	Warpage control High adhesion Reduced solder flash

Module encapsulation

Automotive power module

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	For Power modules high thermal conductive semiconductor encapsulation materials		CV4180 CV4380	High heat dissipation Stress reduction High adhesion

SiC power module

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	For high heat resistance power devices semiconductor encapsulation materials		CV8540 series	High heat resistance Low warpage, Low stress High insulation

Inverter module

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	For Power modules high thermal conductive semiconductor encapsulation materials		CV4180 CV4380	High heat dissipation Stress reduction High adhesion
Semiconductor Encapsulation Materials	For high heat resistance power devices semiconductor encapsulation materials		CV8540 series	High heat resistance Low warpage, Low stress High insulation