Products for Mobile products

Smart phone, Tablet PC

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen and antimony free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials
Low Dk halogen-free multi-layer circuit board materials Halogen-free Laminate : R-A555(W)
Prepreg : R-A550(W)
  • Low Dk
  • Low CTE
  • High heat resistance
Circuit Board Materials
Circuit Board Materials
Mass laminations(Shield board) PreMulti -
  • High multi-layered ~24 layers
  • AOI inspection for all materials
  • Quick delivery
IC package
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Low stress materials for thinner IC substrate LEXCM GX Laminate :
R-G525T, R-G525F
Prepreg :
R-G520T, R-G520F
  • Low stress
  • Excellent warpage performance
  • Considerable cost advantage (E-glass)
Circuit Board Materials
Circuit Board Materials
Ultra-thin circuit board materials LEXCM GX Laminate : R-1515E
Prepreg : R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
Various modules, Connector
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
LCP flexible circuit board materials FELIOS LCP Double-sided copper clad : R-F705S
  • Low transmission loss
  • High frequency characteristics
  • Moisture resistance
Circuit Board Materials
Circuit Board Materials
Flexible circuit board materials resin coated copper foil FELIOS FRCC Material for thinner and multilayed : R-FR10
  • Can be multi-layered thin
  • Decrease a manufacture process
  • Halogen-free
Plastic Molding Compound
Plastic Molding Compound
High fluidity LCP resin molding compounds MBL540V
MBL240V
  • High weld strength
  • Thin-wall molding
  • Dimensional stability
Touch panel
Product category Product name Product number Features / Proposals
Advanced Films
Advanced Films
Anti-Glare Type Anti-Reflection Films MUAG8 (G202N)
  • Low Reflectance 0.5% (SCI)
  • Excellent Weatherability Conforming to the DIN 75220
  • High Infrared Ray Transmittance
Advanced Films
Advanced Films
Clear Type Anti-Reflection Films MUAR5 (C100N)
  • Cutting-Edge Low Reflectance
  • Neutral color
  • High Infrared Ray Transmittance
Advanced Films
Advanced Films
Moldable Low-Reflection Films GSP109A
  • 120-130% Stretchable
  • Chemical resistance,
    Anti-Fingerprint
  • Low-Reflection
Advanced Films
Advanced Films
Anti-Rainbow and Anti-Blackout Films MUAH4029
MUAH40J
  • Prevent Rainbows and Blackout
  • Effective when using polarized sunglasses
  • Fortified Surface with Anti-Fingerprint (MUAH40J)

Semiconductor Encapsulation, Surface Mount Assembly Reinforcement, Adhesion

PoP, MUF
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
Thin surface mounting semiconductor encapsulation materials LEXCM CF CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control
QFP/SOP, BGA/CSP
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM LF CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
NCP, CUF
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM LF CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
Sidefill/Underfill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
For Secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM AF CV5313
CV5314
  • Drop impact resistance
  • Underfill reinforcement
  • Sidefill reinforcement
Large encapsulation area
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
For SMD module low warpage liquid encapsulant LEXCM LF CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash
Adhesion
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive
Thermosetting/UV curing Adhesives LEXCM GF CV5000 series
CV7000 series
  • Bonding of various materials
  • Solvent resistance
  • Time-lagged curing