Products for Mobile products

Each application of Mobile products

Smart phone, Tablet PC

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen and antimony free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials		 Low Dk halogen-free multi-layer circuit board materials Halogen-free Laminate : R-A555(W)
Prepreg : R-A550(W)
  • Low Dk
  • Low CTE
  • High heat resistance
IC package
Circuit Board Materials
Circuit Board Materials		 Ultra-thin circuit board materials LEXCM GX Laminate :
R-151YE, R-1515E
Prepreg :
R-141YE, R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
Various modules, Connector
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 LCP flexible circuit board materials FELIOS LCP Double-sided copper clad : R-F705S
  • Low transmission loss
  • High frequency characteristics
  • Moisture resistance
Circuit Board Materials
Circuit Board Materials		 Flexible circuit board materials resin coated copper foil FELIOS FRCC Material for thinner and multilayed : R-FR10
  • Can be multi-layered thin
  • Decrease a manufacture process
  • Halogen-free
Touch panel
Product category Product name Product number Features / Proposals
Advanced Films
Advanced Films		 Anti-Reflection Films Anti-Glare Type
MUAG8

Clear Type
MUAR5
  • Low Reflectance 0.5% or Less (SCI)
  • Excellent Scratch Resistance
  • Excellent Weatherability

Semiconductor Encapsulation, Surface Mount Assembly Reinforcement, Adhesion

PoP, MUF
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials		 Thin surface mounting semiconductor encapsulation materials LEXCM CF CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control
QFP/SOP, BGA/CSP
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials		 Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM DF CV5300 series
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
NCP, CUF
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials		 Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM DF CV5300 series
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
Sidefill/Underfill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials		 For Secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM DF CV5313
CV5314
  • Drop impact resistance
  • Underfill reinforcement
  • Sidefill reinforcement
Large encapsulation area
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials		 For SMD module low warpage liquid encapsulant LEXCM DF CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash