| Glass transition temp.(Tg) :DSC (°C) |
153 |
| Glass transition temp.(Tg) :TMA (°C) |
150 |
| Glass transition temp.(Tg) :DMA (°C) |
175 |
| Thermal decomposition temp.(Td):TGA (°C) |
355 |
| Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) |
110 |
| Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) |
18 |
| CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) |
11-13 |
| CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) |
13-15 |
| CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) |
40 |
| CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) |
240 |
| Thermal conductivity:Laser flash,25˚C |
- |
| Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) |
1 x 109 |
| Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) |
1 x 108 |
| Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
5 |
| Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
4.6 |
| Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 |
- |
| Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 |
- |
| Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
0.014 |
| Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
0.014 |
| Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 |
- |
| Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 |
- |
| Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) |
0.11 |
| Flexural modulus,Warp/MD:JIS C 6481 |
- |
| Flexural modulus,Fill/TD:JIS C 6481 (GPa) |
22 |
| Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) |
1.5 |
| Flammability:UL,C-48/23/50 |
94V-0 |
| The sample thickness |
0.8mm |
| The above data are typical values and not guaranteed values. |
- |
| *1 Test method: TMA |
- |