- Leveraging multi-layer processability, low transmission loss, high thermal conductivity and Halogen-free, these materials are suitable for miniaturized and 5G small cell PCBs.
Circuit Board Materials
- Part Number
Laminate R-5575
Prepreg R-5470
- Application
- Detailed use
・Automotive
・Wireless
・Wireless
Power amplifier board (Base station for wireless communication, Small cell), Antenna (Automotive millimeter-wave radar, Base station), Etc.
Properties
Dk 3.6 Df 0.005
@10GHz
@10GHz
Thermal conductivity
0.60W/m·K
0.60W/m·K
Tg(DMA)
245°C
245°C
Video
Frequency dependence by Transmission loss
Long-term stability under High temperature(Dk, Df)
General properties
| Item | Test method | Condition | Unit | XPEDION T1 R-5575 |
Other company | |
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | TMA | A | °C | 205 | Tg less | |
| DMA | 245 | Tg less | ||||
| Thermal decomposition temp.(Td) | TGA | A | °C | 440 | 414 | |
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 20 | 21 |
| α2 | 155 | 42 | ||||
| T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | >120 | |
| Thermal conductivity | Laser flash | A | W/m·K | 0.6 | 0.6 | |
| Dielectric constant(Dk) | 10GHz | Cavity resonance | C-24/23/50 | － | 3.6 | 3.5 |
| Dissipation factor(Df) | 0.005 | 0.004 | ||||
| Flexural strength | IPC-TM-650 | A | N/mm2 | 440 | No Data | |
| Peel strength* | 1oz(35µm) | IPC-TM-650 2.4.8 | A | kN/m | 0.80 | 0.58 |
| Flammability | UL | C-48/23/50 | － | 94V-0(HF) | 94V-0(Br) | |
The sample thickness is 0.5mm
* RT Copper
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
Related information
[ Product summary ]
[ Data Sheet ]
- * Revised due to changes in high-frequency measuring equipment
** Former version, Before April 2022
