
- Leveraging multi-layer processability, low transmission loss, high thermal conductivity and Halogen-free, these materials are suitable for miniaturized and 5G small cell PCBs.
Circuit Board Materials
- Part Number

Laminate R-5575
Prepreg R-5470

- Application
- Detailed use


・Automotive
・Wireless
・Wireless
Power amplifier board (Base station for wireless communication, Small cell), Antenna (Automotive millimeter-wave radar, Base station), Etc.
Properties
Dk 3.6 Df 0.005
@10GHz
@10GHz
Thermal conductivity
0.60W/m·K
0.60W/m·K
Tg(DMA)
245°C
245°C
Video
Frequency dependence by Transmission loss

Long-term stability under High temperature(Dk, Df)

General properties
Item | Test method | Condition | Unit | XPEDION T1 R-5575 |
Other company | |
---|---|---|---|---|---|---|
Glass transition temp.(Tg) | TMA | A | °C | 205 | Tg less | |
DMA | 245 | Tg less | ||||
Thermal decomposition temp.(Td) | TGA | A | °C | 440 | 414 | |
CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 20 | 21 |
α2 | 155 | 42 | ||||
T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | >120 | |
Thermal conductivity | Laser flash | A | W/m·K | 0.6 | 0.6 | |
Dielectric constant(Dk) | 10GHz | Cavity resonance | C-24/23/50 | - | 3.6 | 3.5 |
Dissipation factor(Df) | 0.005 | 0.004 | ||||
Flexural strength | IPC-TM-650 | A | N/mm2 | 440 | No Data | |
Peel strength* | 1oz(35µm) | IPC-TM-650 2.4.8 | A | kN/m | 0.80 | 0.58 |
Flammability | UL | C-48/23/50 | - | 94V-0(HF) | 94V-0(Br) |
The sample thickness is 0.5mm
* RT Copper
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.