High elasticity Low CTE IC substrate materials | R-1515W

Low warpage circuit board materials MEGTRON GX R-1515W


  1. Achieve more functionality (multi-pin and integrated circuit) the large-sized PKG by excellent modulus and high heat resistance property

Circuit Board Materials

  • Part Number

Laminate R-1515W
Prepreg R-1410W

  • Application
IC substrate
IC substrate

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.


Flexural modulus
25°C 35GPa
CTE x, y-axis
Tg (DMA)

Pakage warpage

Pakage warpage

Thermal expansion (x-axis)

Thermal expansion (x-axis)

Heat resistance

Heat resistance

General properties

Item Test method Condition Unit LEXCM GX
Glass transition temp (Tg) DMA*2 A °C 250
Thermal decomposition temp (Td) TGA A °C 390
CTE x-axis α1 Internal method A ppm/°C 8-10
CTE y-axis 8-10
CTE z-axis α1 IPC-TM-650 2.4.24 A 22
α2 97
Flexural modulus*1 JIS C 6481 25°C GPa 35
250°C 21

The sample thickness is 0.1mm.
*1 0.8mm
*2 Measurement in bending mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.