- Achieving high mountability and high heat dissipation → Package warpage control
- Suitable for large packages with heat spreaders exposed → T/C resistance improvement due to stress reduction
- Compatible with nickel plating → Achieved high adhesion
Semiconductor Encapsulation Materials
- Part Number
CV4180 CV4380
- Application
- Detailed use
・Package
・Automotive
・Automotive
Automotive module, Inverter module for major appliances and industrial motors
Properties
High heat dissipation
Stress reduction
High adhesion
EMC (Epoxy Molding Compound) explainer video
Stress reduction:Thermal cycle(T/C) resistance
Nickel plating adhesion:Shear adhesive strength
Line-up
| Part Number | Applications | Features |
|---|---|---|
| CV3300 / CV4380 | Encapsulation of fully-molded module | High thermal conductive grade(1.7∼2.3 W/mK) |
| CV4500 / CV4580 | Super high thermal conductive grade(3.0∼3.5 W/mK) | |
| CV4100A/CV4180A | Encapsulation of module with heat spreader exposed | Low stress type for metallic substrates |
| CV4100B/CV4180B | Low stress type for ceramic substrates |
