- Achieving high mountability and high heat dissipation → Package warpage control
- Suitable for large packages with heat spreaders exposed → T/C resistance improvement due to stress reduction
- Compatible with nickel plating → Achieved high adhesion
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV4180 CV4380
- Application
- Detailed use
・Package
・Automotive
・Automotive
Automotive module, Inverter module for major appliances and industrial motors
Properties
High heat dissipation
Stress reduction
High adhesion
Stress reduction:Thermal cycle(T/C) resistance
Nickel plating adhesion:Shear adhesive strength
Line-up
| Part Number | Applications | Features |
|---|---|---|
| CV3300 / CV4380 | Encapsulation of fully-molded module | High thermal conductive grade(1.7∼2.3 W/mK) |
| CV4500 / CV4580 | Super high thermal conductive grade(3.0∼3.5 W/mK) | |
| CV4100A/CV4180A | Encapsulation of module with heat spreader exposed | Low stress type for metallic substrates |
| CV4100B/CV4180B | Low stress type for ceramic substrates |
The written property values are just an example of our product line-up. Please contact us for details.
