For power modules high thermal conductive semiconductor encapsulation materials | CV4180, CV4380

For power modules high thermal conductive semiconductor encapsulation materials

 

  1. Achieving high mountability and high heat dissipation → Package warpage control
  2. Suitable for large packages with heat spreaders exposed → T/C resistance improvement due to stress reduction
  3. Compatible with nickel plating → Achieved high adhesion

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV4180 CV4380

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Automotive module, Inverter module for major appliances and industrial motors

Properties

High heat dissipation
Stress reduction
High adhesion

Stress reduction:Thermal cycle(T/C) resistance

Stress reduction:Thermal cycle(T/C) resistance

Nickel plating adhesion:Shear adhesive strength

Nickel plating adhesion:Shear adhesive strength

Line-up

Part Number Applications Features
CV3300 / CV4380 Encapsulation of fully-molded module High thermal conductive grade(1.7∼2.3 W/mK)
CV4500 / CV4580 Super high thermal conductive grade(3.0∼3.5 W/mK)
CV4100A/CV4180A Encapsulation of module with heat spreader exposed Low stress type for metallic substrates
CV4100B/CV4180B Low stress type for ceramic substrates

The written property values are just an example of our product line-up. Please contact us for details.