Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series

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Contribute to improving the reliability of semiconductor package
such as a power device requiring automotive quality

Semiconductor Encapsulation Materials

  • For Automotive IC package Delamination free
    surface mounting semiconductor encapsulation materials CV8213
  • For Power modules High thermal conductive
    semiconductor encapsulation materials  CV4180, CV4380
  • For high heat resistance power devices
    semiconductor encapsulation materials CV8540

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Application Our oroposal
Power device
Power device

For Automotive IC package Delamination free
surface mounting semiconductor encapsulation materials
CV8213

High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG

For Power modules High thermal conductive
semiconductor encapsulation materials
CV4180, CV4380

High heat dissipation Stress reduction High adhesion

For high heat resistance power devices
semiconductor encapsulation materials
CV8540

High heat resistance Low warpage, Low stress High insulation

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