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Contribute to improving the reliability of advanced semiconductor package
such as wafer level package, FC CSP/BGA, Wifi module, etc.
such as wafer level package, FC CSP/BGA, Wifi module, etc.
Semiconductor Encapsulation Materials/Adhesive
- Encapsulation Materials for FOWLP/PLP CV8511C, CV2308, CV5791
- Molded Underfill(MUF) Semiconductor encapsulation Molding compounds CV8710
- Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300, CV5350
- Thin surface mounting Semiconductor encapsulation materials CV8710, CV8760
- For SMD module low warpage liquid encapsulant CV5386, CV5401
Line up
| Application | Our proposal |
|---|---|
WLP/PLP |
Encapsulation Materials for FOWLP/PLP CV8511C, CV2308, CV5791 Low stress Low shrinkage Low temp.curability |
FC CSP / FC BGA |
Molded Underfill(MUF) Semiconductor encapsulation Molding compounds CV8710 Saving process time for Narrow gap/pitch Low warpage |
|
Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300, CV5350 High fluidity for Narrow gap/pitch Reduced void/bleed |
|
|
Thin surface mounting Semiconductor encapsulation materials CV8710, CV8760 Thinner High-density wiring Warpage control |
|
Wifi module |
For SMD module low warpage liquid encapsulant CV5386, CV5401 Warpage control High adhesion Reduced solder flash |
