Mass laminations(Shield board) "PreMulti"

Reduces the load of customers' circuit formation. Contribute to the impedance matching and crosstalk prevention by increasing flexibility of board design.
Possible to be high multi-layered up to 24 layers.
Quick delivery from order to shipment.

Circuit Board Materials

  • Part Number
  • Application
  • Detailed use
Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.


High multi-layered
~24 layers
AOI inspection for
all materials
Quick delivery

What's Mass laminations?

What's Mass laminations?


Product Number Comment
C-1810 Glass epoxy resin shield board used R-1766 material
C-1510 Halogen-free shield board used R-1566 material
C-1850D High heat resistance shield board for Automotive component used R-1755D material
C-1850S High heat resistance shield board for ICT infrastructure equipment used R-1755S material

Specification list

Item General Specifications
Board thickness(Max) 2.40mm±10%
Board thickness(Min) 0.24mm±10%
Dimensional tolerance between the reference mark ±0.15mm
Accuracy of the layer reach 0.15mm or less
Warpage 1% or less of the long side
Line/Space Copper thickness 12μm: 50/50μm
Copper thickness 18μm: 50/50μm
Copper thickness 35μm: 75/75μm
Copper thickness 70μm: 100/100μm
Copper thickness 105μm: 150/150μm

※The above data is general specifications. Please contact us for more specifications.

The above data are typical values and not guaranteed values.

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