Semiconductor Device Materials

Product List

• IC Substrate Materials "LEXCM GX" series
• Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
• Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
• Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series

공지 사항

[ 2023 ]

• 10월
  18일
  Information
  Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment

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