- Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch)
- Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)
Semiconductor Encapsulation Materials/Adhesive
- Part Number
- Detailed use
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
Trends and required performance
Use of high moldability-evaluation technology has achieved excellent fillability.
Lineup of materials selectable according to warpage
The above data are typical values and not guaranteed values.