Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series

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Contribute to improving the reliability of advanced semiconductor package
such as wafer level package, FC CSP/BGA, Wifi module, etc.

Semiconductor Encapsulation Materials

  • Encapsulation Materials for FOWLP/PLP
    CV8511CUB
  • Molded Underfill(MUF) Semiconductor encapsulation Molding compounds
    CV8581, CV8713
  • Capillary Underfill(CUF) Semiconductor encapsulation materials
    CV5300
  • Thin surface mounting Semiconductor encapsulation materials
    CV8710, CV8760
  • For SMD module low warpage liquid encapsulant
    CV5386, CV5401

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Application Our proposal
WLP/PLP
WLP/PLP

Encapsulation Materials for FOWLP/PLP
CV8511CUB

Low stress Low shrinkage Low temp.curability

FC CSP / FC BGA
FC CSP

Molded Underfill(MUF) Semiconductor encapsulation Molding compounds
CV8581, CV8713

Saving process time for Narrow gap/pitch Low warpage

Capillary Underfill(CUF) Semiconductor encapsulation materials
CV5300

High fluidity for Narrow gap/pitch Reduced void/bleed

Thin surface mounting Semiconductor encapsulation materials
CV8710, CV8760

Thinner High-density wiring Warpage control

Wifi module
Wifi module

For SMD module low warpage liquid encapsulant
CV5386, CV5401

Warpage control High adhesion Reduced solder flash

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