Low CTE Ultra-thin IC substrate materials | R-G515S, R-G515E

Low CTE Ultra-thin IC substrate materials LEXCM GX R-G515

 

  1. With an insulation layer thickness of 15 μm or less, these ultra-thin materials enable thin IC package designs.
  2. The low CTE property can reduce warpage and achieve a good reliability.

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G515S
Prepreg R-G510S

Normal glass cloth

Laminate R-G515E
Prepreg R-G510E

Halogen-free
  • Application
  • Detailed use
Package
・Package
IC substrate
CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)

Properties

CTE x,y-axis 4-6ppm/°C
(Low CTE glass cloth)
Low warpage
Ultra-thin
Excellent moldability

IC package warpage

IC Pakage Warpage

Melting and Curling Behavior

Melting and Curling Behavior

General properties

Item Test method Condition Unit LEXCM GX
R-G515S
Low CTE glass cloth
LEXCM GX
R-G515E
Normal glass cloth
Glass transition temp.(Tg) DMA*² A °C 220-240 220-240
CTE x-axis α1 Internal method A ppm/°C 4-6 6-8
CTE y-axis 4-6 6-8
Dielectric onstant(Dk)*¹ 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.2 4.4
Dissipation factor(Df)*¹ 0.008 0.008
Flexural modulus*¹ JIS C 6481 25°C GPa 28 24

The sample thickness is 0.1mm.
*1 0.8mm *2 Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

Related information