- By adopting a new epoxy system, this material has excellent heat resistance and can be applied to the next generation power devices (SiC, GaN).
- Contribute to improving power module performance and reliability under high temperature environment.
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV8540 series
- Application
- Detailed use
・Package
・Automotive
・Automotive
Power devices used in industry/Automotive inverters
Properties
High heat resistance
Low warpage, Low stress
High insulation
EMC (Epoxy Molding Compound) explainer video
Concept
High heat resistance
Dielectric property (Tg dependence)
General properties
| Item | Unit | CV8540 series | |
| Feature | － | Middle CTE & Low modulus type | Low CTE & Low modulus type |
| C.T.E. (α1/α2) | ppm/°C | 14/65 | 11/60 |
| Tg (TMA) | °C | 210 | 210 |
| Flexural strength (RT/260°C) | MPa | 110/23 | 100/21 |
| Flexural modulus (RT/260°C) | GPa | 13/1.0 | 13/1.0 |
| Cure condition | － | 175°C/100-150sec | |
| Post mold cure | － | 175-200°C/4-8hr (200°C/4hr for above properties) | |
| UL flammability | UL-94 | V-0 | V-0 |
The written property values are just an example of our product line-up. Please contact us for details.
