- Enhances process reliability by warpage control and high adhesion
→ Low warpage of ultrathin module is achieved
- Solder flash during mounting reflow has been reduced, resulting in greatly decreasing the defect ratio
- Large encapsulation area
For SMD module low warpage liquid encapsulant
- CV5386 CV5401
For IC package
Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.
Warpage behavior:Shadow moire analysis
Solder flash after mounting reflow has been reduced (X-ray observation)
The above data is actual values and not guaranteed values.