For SMD module low warpage liquid encapsulant | CV5386, CV5401

For SMD module low warpage liquid encapsulant

 

  1. Enhances process reliability by warpage control and high adhesion
    → Low warpage of ultrathin module is achieved
  2. Solder flash during mounting reflow has been reduced, resulting in greatly decreasing the defect ratio
  3. Large encapsulation area

Product features

For SMD module low warpage liquid encapsulant

ECOM Fine Flow
  • CV5386 CV5401

For IC package

Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.

Warpage behavior:Shadow moire analysis

Warpage behavior:Shadow moire analysis

Solder flash after mounting reflow has been reduced (X-ray observation)

Solder flash after mounting reflow has been reduced (X-ray observation)

The above data is actual values and not guaranteed values.

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