SEMICON China 2021

[News] Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

  • Official web Site
  • Date : Mar 17(Wed) - 19(Fri)
  • Place : Shanghai New International Expo Centre
  • Exhibition Product
    - Electronic Materials
    • Encapsulation/Assembly Reinforcement Materials
      for IC Package
    • IC substrate materials
    - Smart factory solutions, Microelectronics
    • APX300 series, Dry Etcher
    • MD-P300, Flip-chip Bonder
    • PSX307 series, Plasma Cleaner