Liquid Molded Underfill for 2.5D, SiP

One Step, Underfill + Over molding

Panasonic Molded Underfill (MUF) materials enable faster packaging cycle times.

One Material - One Process, High filling ability, Low Warpage

Process Comparison

Technical Paper

Ultra-Low Warpage and Excellent Filling Ability Liquid MUF
for Advanced Fan-Out Wafer Level Package (406KB)
Panasonic attend International Wafer-Level Packaging Conference(IWLPC).
  • Date : October 22 - 24 , 2019
  • Place : Double Tree by Hilton San Jose

Position of encapsulation material

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