Zoom
Contribute to IC substrates as thinner and smaller and low warpage.
Circuit Board Materials
- Ultra-low transmission loss Circuit board materials for IC substrate/ Module
R-G545L(Low Dk glass cloth), R-G545E(Normal glass cloth) - High modulus Low CTE IC substrate materials
R-G535S(Low CTE glass cloth), R-G535E(Normal glass cloth) - Low CTE Ultra-thin IC substrate materials
R-G515S(Low CTE glass cloth), R-G515E(Normal glass cloth) - High elasticity Low CTE Ultra-thin IC substrate materials R-1515E
- Low CTE IC substrate materials Designed to Improve Reliability R-1515V
- High elasticity Low CTE IC substrate materials R-1515W
- Low CTE IC substrate materials R-1515A
Line-up
General properties
| Item | Test method | Condition | Unit | R-1515V | R-1515K | R-G535S | R-G535E | |
|---|---|---|---|---|---|---|---|---|
| Glass transition temp(Tg) | DMA*2 | A | °C | 260 | 260 | 260 | 260 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 3-5 | 7 | 4-6 | 7-8 |
| CTE y-axis | 3-5 | 7 | 4-6 | 7-8 | ||||
| Dielectric constant(Dk)*1 | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | － | 4.4 | 4.6 | 4.4 | 4.6 |
| Dissipation factor(Df)*1 | 0.016 | 0.015 | 0.015 | 0.015 | ||||
| Flexural modulus*1 | JIS C 6481 | 25°C | GPa | 30 | 27 | 32-34 | 28-30 | |
| 250°C | 14 | 12 | 20-22 | 18-20 | ||||
| Peel strength | 1/3oz | IPC-TM-650 2.4.8 | A | kN/m | 0.6 | 0.6 | 0.7 | 0.7 |
| Thickness line-up | mm | 0.20-1.8 | 0.20-1.8 | 0.20-1.8 | 0.20-1.8 | |||
| Item | Test method | Condition | Unit | R-1515W | R-1515A | R-G545L | R-G545E | |
|---|---|---|---|---|---|---|---|---|
| Glass transition temp(Tg) | DMA*2 | A | °C | 250 | 205 | 230 | 230 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 9 | 12 | 10 | 10 |
| CTE y-axis | 9 | 12 | 10 | 10 | ||||
| Dielectric constant(Dk)*1 | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | － | 4.8 | 4.8 | 3.6 | 4.1 |
| Dissipation factor(Df)*1 | 0.015 | 0.015 | 0.002 | 0.002 | ||||
| Flexural modulus*1 | JIS C 6481 | 25°C | GPa | 35 | 27 | 23 | 27 | |
| 250°C | 21 | 10 | 10 | 13 | ||||
| Peel strength | 1/3oz | IPC-TM-650 2.4.8 | A | kN/m | 0.9 | 0.9 | 0.6 | 0.6 |
| Thickness line-up | mm | 0.20-0.8 | 0.10-0.8 | 0.04-0.2 | 0.04-0.2 | |||
| Item | Test method | Condition | Unit | R-G515S | R-G515E | R-1515E | |
|---|---|---|---|---|---|---|---|
| Glass transition temp(Tg) | DMA*2 | A | °C | 220-240 | 220-240 | 270 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 4-6 | 6-8 | 9 |
| CTE y-axis | 4-6 | 6-8 | 9 | ||||
| Dielectric constant(Dk)*1 | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | － | 4.2 | 4.4 | 4.7 |
| Dissipation factor(Df)*1 | 0.008 | 0.008 | 0.011 | ||||
| Flexural modulus*1 | JIS C 6481 | 25°C | GPa | 28 | 24 | 33 | |
| 250°C | － | － | 18 | ||||
| Peel strength | 1/3oz | IPC-TM-650 2.4.8 | A | kN/m | 0.7 | 0.7 | 0.9 |
| Thickness line-up | mm | 0.03-0.1 | 0.03-0.1 | 0.04-0.2 | |||
The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode. R-1515W, R-1515A: Measurement in bending mode.
The above data are typical values and not guaranteed values.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
