- Achieve more functionality (multi-pin and integrated circuit) the large-sized PKG by excellent modulus and high heat resistance property
Circuit Board Materials
- Part Number
New branding announcement
- Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Thermal expansion (x-axis)
|Item||Test method||Condition||Unit||LEXCM GX
|Glass transition temp (Tg)||DMA*2||A||°C||250|
|Thermal decomposition temp (Td)||TGA||A||°C||390|
|CTE x-axis||α1||Internal method||A||ppm/°C||8-10|
|CTE z-axis||α1||IPC-TM-650 2.4.24||A||22|
|Flexural modulus*1||JIS C 6481||25°C||GPa||35|
The sample thickness is 0.1mm.
*2 Measurement in bending mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
The above data are typical values and not guaranteed values.