High elasticity Low CTE IC substrate materials | R-1515W

Low warpage circuit board materials MEGTRON GX R-1515W

 

  1. Achieve more functionality (multi-pin and integrated circuit) the large-sized PKG by excellent modulus and high heat resistance property

Circuit Board Materials

  • Part Number

Laminate R-1515W
Prepreg R-1410W

Halogen-free
  • Application
IC substrate
IC substrate
 

Properties

Flexural modulus
25°C 35GPa
CTE x, y-axis
8-10ppm/°C
Tg (DMA)
250°C

Pakage warpage

Pakage warpage

Thermal expansion (x-axis)

Thermal expansion

Heat resistance

Heat resistance

General properties

Item Test method Condition Unit LEXCM GX
R-1515W
Glass transition temp (Tg) DMA*2 A °C 250
Thermal decomposition temp (Td) TGA A °C 390
CTE x-axis α1 Internal method A ppm/°C 8-10
CTE y-axis 8-10
CTE z-axis α1 IPC-TM-650 2.4.24 A 22
α2 97
Flexural modulus*1 JIS C 6481 25°C GPa 35
250°C 21

The sample thickness is 0.1mm.
*1 0.8mm
*2 Measurement in bending mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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