- With an insulation layer thickness of 15 μm or less, these ultra-thin materials enable thin IC package designs.
- The low CTE property can reduce warpage and achieve a good reliability.
Circuit Board Materials
- Part Number
Low CTE glass cloth
Laminate R-G515S
Prepreg R-G510S
Normal glass cloth
Laminate R-G515E
Prepreg R-G510E
- Application
- Detailed use
・Package
IC substrate
CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)
CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)
New branding announcement
- Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Properties
CTE x,y-axis 4-6ppm/°C
(Low CTE glass cloth)
(Low CTE glass cloth)
Low warpage
Ultra-thin
Excellent moldability
Excellent moldability
IC package warpage
Melting and Curling Behavior
General properties
| Item | Test method | Condition | Unit | LEXCM GX R-G515S Low CTE glass cloth |
LEXCM GX R-G515E Normal glass cloth |
|
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA* | A | °C | 220-240 | 220-240 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 4-6 | 6-8 |
| CTE y-axis | 4-6 | 6-8 | ||||
| Young’s modulus | ASTM D3039 | 25°C | GPa | 23-28 | 22-27 | |
| Peel strength | 1/3oz | IPC-TM-650 2.4.8 | A | kN/m | 0.7 | 0.7 |
The sample thickness is 0.1 mm.
* DMA: Measurement in tensile mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
