Non-silicone thermosetting insulation film with high heat resistance and environmental stability.
A pliable and stretchable substrate follows 3D shapes that cannot be achieved with conventional flexible substrates.
Can be the foundation for many new innovative applications for stretchable electronics.
Other New Materials
- Part Number
- Detailed use
Devices in printed electronics applications such as wearable, healthcare, medical, automotive, energy harvesting, aerospace, etc.
High temperature resistance
BEYOLEX is an unique insulation material based on a proprietary, thermoset, non-silicone polymer system which provides softness, conformability, high-temperature resistance, and compatibility with a wide variety of functional inks and pastes, contributes to the creation of new innovative stretchable electronics.
Demonstrator Video (Production cooperation: Printed Electronics Ltd.)
LED: Wiring does not break when bent or stretched and returns to its original state.
NFC: In addition to stretching and shrinking, immersion in water does not cause functional problems.
|Item||Test method *¹||Unit||BEYOLEX
|Elongation||ASTM D822||Initial||%||200 <|
|Aft. High Temp. and High Humid. test *²||200 <|
|Aft. Heat cycle *³||200 <|
|Modulus @50% strain||ASTM D822||Initial||MPa||< 2.5|
|Aft. High Temp. and High Humid. test||< 2.5|
|Aft. Heat cycle||< 2.5|
|Hysteresis||Panasonic Original||Initial||%||< 0.1|
|Aft. High Temp. and High Humid. test||< 0.1|
|Aft. Heat cycle||< 0.1|
|Heat resistance||TG/DTA (@Air) 5% weight loss||°C||302|
|Breakdown voltage||IEC 60243-1||KV/mm||98|
|Dielectric constant(Dk)||IPC TM650 188.8.131.52||@10GHz / @2GHz||–||2.8 / 3.3|
|Dissipation factor(Df)||@10GHz / @2GHz||–||0.052 / 0.073|
|Transparency||ISO 13468-1||%||> 90|
|Stretch cycle||50% stretch||cycle||> 10000|
*1 Measurement are compliant with the standards other than Panasonic’s original test.
*2 Test Condition: 85°C/ 85%RH/ 1000h
*3 Test Condition: -55°C(5min) ↔ 125°C(5min)/ 1000cyc
The above data are typical values and not guaranteed values.