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●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
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Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
High heat resistance Phenolic Molding Compound for Automotive Components
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
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Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
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AMTECLEAN A
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Information
[ 2023 ]
Aug
4
New product
Aspherical Glass Lenses : The part number of For LD applications (17 part number), For optical communications (34 part number) has been added.
[ 2017 ]
Sep
21
Will Bring to Market Aspherical Glass Lenses (Square Type) for Compact High-speed Optical Transmission Modules
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