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What's New
2023
- Oct 12, 2023
- Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment
- May 15, 2023
- Panasonic Industry Develops High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards
- Mar 16, 2023
- Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments
2022
- Aug 30, 2022
- Price Revision on Semiconductor Encapsulation Materials
- Aug 22, 2022
- Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development with JAXA
- June 22, 2022
- Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications
- Jan 18, 2022
- Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
2021
- Nov 10, 2021
- Price Revision on Semiconductor Encapsulation Materials
- Aug 6, 2021
- Introduction of New Material For Next Generation Display Development
TOUGHTELON - Jun 22, 2021
- Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
- Mar 2, 2021
- Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
- Feb 25, 2021
- Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas
2020
- May 19, 2020
- Exhibition information: ECTC 2020 Virtual Conference
- Jan 7, 2020
- Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”
2019
2018
- Dec 21, 2018
- Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019
- Dec 13, 2018
- To Bolster Substrate Material Business in North East Asian Region
- Sep 3, 2018
- Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
- Aug 29, 2018
- Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
- Jun 4, 2018
- Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
- May 29, 2018
- Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
- Mar 9, 2018
- Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
- Feb 8, 2018
- Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
- Jan 11, 2018
- Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas
2017
- Jun 1, 2017
- Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
- May 12, 2017
- Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
- Feb 3, 2017
- Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
- Jan 17, 2017
- Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials
2016
- Dec 27, 2016
- Price Revision for Copper clad Laminates and Mass Laminations
- Dec 22, 2016
- Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
- Aug 25, 2016
- Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
- May 30, 2016
- Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
- May 26, 2016
- Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
- Apr 5, 2016
- Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
- Mar 18, 2016
- Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
- Mar 3, 2016
- Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires
- Feb 12, 2016
- Panasonic Commercializes Polybutylene Terephthalate (PBT) Molding Compounds for Laser Welding
2015
- Dec 24, 2015
- Panasonic Develops a Stretchable Resin Film and Its Application Materials For Stretchable Electronics
- Dec 21, 2015
- Panasonic to Start Production of Heat-Resistant Phenolic Molding Compounds for Automotive Parts in Ayutthaya, Thailand
- Oct 1, 2015
- Panasonic Commercializes High Heat-Resistant Semiconductor Encapsulation Material for Power Devices
2014
- June 12, 2014
- Panasonic develops "Full Bright PP" an optical reflective polypropylene resin molding compound
- May 28, 2014
- Panasonic Develops MEGTRON7 Multi-layer Circuit Board Material with the Industry's Lowest Transmission Loss*1
2013
- Oct 1, 2013
- Panasonic Establishes Electronic Materials South Asia R&D Center in Singapore
- June 11, 2013
- Announcing the release of thermosetting plastic molding-materials, “FULL BRIGHT”
- June 4, 2013
- Announcing the release of “ Fine-wiring electrode film ”
2012
