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Semiconductor Device Materials

Product List

• IC Substrate Materials "LEXCM GX" series
• Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM LF" series
• Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
• Liquid Materials for Board level Underfill, Adhesives

Information

[ 2021 ]

• Jun
  22
  New product
  Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
• Mar
  2
  New product
  Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

[ 2018 ]

• Dec
  13
  To Bolster Substrate Material Business in North East Asian Region
• Sep
  3
  Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
• Aug
  29
  Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP

News list