In the industrial field where progress is being made to achieve automation, Panasonic provides devices best suited to customer's needs.
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Capacitors
- Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
- Conductive Polymer Tantalum Solid Capacitors (POSCAP)
- Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- Aluminum Electrolytic Capacitors (Surface Mount Type)
- Film Capacitors (Electronic Equipment Use)
- Film Capacitors (Automotive, Industrial and Infrastructure Use)
Resistors
- High Temperature Chip Resistors
- High Precision Chip Resistors
- Current Sensing Chip Resistors
- Small & High Power Chip Resistors
- Anti-Sulfurated Chip Resistors
Inductors
Thermal Management Solutions
EMC Components
Circuit Protection
Sensors
Input Devices
Relays
- PhotoMOS®
- AQ-J Solid State Relay
- AQ-A (DC output type) Solid State Relay
- Power Relays (Over 2A)
- Safety Relays
- Microwave Devices (Microwave Relays/Coaxial Switches)
Connectors
- Narrow Pitch Connector for board to FPC
- FPC/FFC Connector
- Narrow Pitch Connector for board to board
- Active Optical Connector
FA Devices
Motors
Optical Components
Welding Machines, Robots
Batteries (for Business)
Electronic Materials
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7
- Halogen-free Ultra-low transmission loss Multi-layer circuit board materials, Halogen-free MEGTRON6
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6
- Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type> HIPER M
- Highly heat resistant Low CTE Multi-layer circuit board materials HIPER E
- Flexible circuit board materials FELIOS
- Halogen-free Multi-layer circuit board materials
- Glass composite circuit board materials
- Thick copper glass composite circuit board materials
- Paper phenolic circuit board materials
- Liquid Materials for Board level Underfill, Adhesives
- For power modules high thermal conductive semiconductor encapsulation materials
- For high heat resistance power devices semiconductor encapsulation materials