High elasticity Low CTE Ultra-thin IC substrate materials | R-1515E

Ultra-thin circuit board materials MEGTRON GX R-1515E


  1. Contribute to thin IC package by ultra-thin material and decrease the substrate warpage by low CTE property

Circuit Board Materials

  • Part Number

Laminate R-1515E
Prepreg R-1410E

  • Application
IC substrate

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.


Flexural modulus
25°C 33GPa
CTE x, y-axis
Tg (DMA)

Package warpage(FBGA)

PKG warpage (FBGA)

Thermal expansion(x-axis)

Cross section (SEM observation)

General properties

Item Test method Condition Unit LEXCM GX
Glass transition temp.(Tg) DMA*2 A °C 270
Thermal decomposition temp.(Td) TGA A °C 390
CTE x-axis α1 Internal method A ppm/°C 8-10
CTE y-axis 8-10
CTE z-axis*1 α1 IPC-TM-650 2.4.24 A 22
α2 95
Flexural modulus*1 JIS C 6481 25°C GPa 33
250°C 18

The sample thickness is 0.1mm.
*1 0.8mm
*2 Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.