Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Major application | Product name | Product number | Features / Proposals | Detailed application | |
---|---|---|---|---|---|
![]() ICT infrastructure equipment |
Low transmission loss multi-layer materials | ![]() series |
Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal | ||
![]() ICT infrastructure equipment |
Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials | ![]() Laminate : R-5795(U) R-5795(N) Prepreg : R-5690(U) R-5690(N) |
|
|
|
![]() ![]() ICT infrastructure equipment Aerospace |
Ultra-low transmission loss multi-layer circuit board materials | ![]() Laminate : R-5785(N) R-5785(GN) R-5785(GE) R-5785(R)* Prepreg : R-5680(N) R-5680(GN) R-5680(GE) *Buried Resistor Copper Foil |
|
|
|
![]() ICT infrastructure equipment |
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials | ![]() Laminate : R-5375(N) R-5375(E) Prepreg : R-5370(N) R-5370(E) |
|
|
|
![]() ![]() ICT infrastructure equipment Aerospace |
Ultra-low transmission loss multi-layer circuit board materials | ![]() Laminate : R-5775(N) R-5775(K) R-5775(G) R-5775(S)* R-5775(R)* Prepreg : R-5670(N) R-5670(K) R-5670(G) *Buried Resistor Copper Foil |
|
|
|
![]() ICT infrastructure equipment |
Low transmission loss multi-layer materials | ![]() ![]() Laminate : R-5725S, R-5725 Prepreg : R-5620S, R-5620 |
|
|
|
![]() ICT infrastructure equipment |
Low transmission loss multi-layer materials | ![]() Laminate : R-5735 Prepreg : R-5630 |
|
|
|
![]() ICT infrastructure equipment |
Low transmission loss multi-layer materials | ![]() Laminate : R-1577, R-1577E Prepreg : R-1570, R-1570E |
|
|
|
![]() ICT infrastructure equipment |
High heat resistance (High-Tg) multi-layer circuit board materials | ![]() Laminate : R-1755V Prepreg : R-1650V |
|
|
|
![]() ![]() Automotive Antenna |
Multi-layer Circuit Board Materials for wireless/ RF communication equipment | ![]() series |
Multi-layer circuit board materials that achieve low transmission losses in Radio Frequency range. | ||
![]() ![]() Automotive Antenna |
Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials | ![]() Laminate : R-5515 Prepreg : R-5410 |
|
|
|
![]() ![]() Automotive Antenna |
High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials | ![]() Laminate : R-5575 Prepreg : R-5470 |
|
|
|
![]() IC package |
Narrow pitch corresponding circuit board materials | ![]() series |
Contribute to IC substrates as thinner and smaller and low warpage | ||
![]() IC package |
Ultra-low transmission loss Circuit board materials for IC substrate/Module | ![]() Laminate : R-G545L, R-G545E Prepreg : R-G540L, R-G540E |
|
|
|
![]() IC package |
High modulus Low CTE IC substrate materials | ![]() Laminate : R-G535S, R-G535E |
|
|
|
![]() IC package |
Low stress materials for thinner IC substrate | ![]() Laminate : R-G525T, R-G525F Prepreg : R-G520T, R-G520F |
|
|
|
![]() IC package |
Low CTE Ultra-thin IC substrate materials | ![]() Laminate : R-G515S, R-G515E Prepreg : R-G510S, R-G510E |
|
|
|
![]() IC package |
Low CTE IC substrate materials Designed to Improve Reliability | ![]() Laminate : R-1515V Prepreg : R-1410V |
|
|
|
![]() IC package |
Narrow pitch corresponding circuit board materials | ![]() Laminate : R-1515W Prepreg : R-1410W |
|
|
|
![]() IC package |
Narrow pitch corresponding circuit board materials | ![]() Laminate : R-1515A Prepreg : R-1410A |
|
|
|
![]() IC package |
Ultra-thin circuit board materials | ![]() Laminate : R-1515E Prepreg : R-1410E |
|
|
|
![]() Automotive |
High heat resistance multi-layer materials | ![]() series |
Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability | ||
![]() Automotive |
High heat resistance (High-Tg) multi-layer circuit board materials | ![]() Laminate : R-1755D Prepreg : R-1650D |
|
|
|
![]() Automotive |
High heat resistance (Middle-Tg) multi-layer circuit board materials | ![]() Laminate : R-1755M Prepreg : R-1650M |
|
|
|
![]() Automotive |
High heat resistance multi-layer circuit board materials | ![]() Laminate : R-1755E Prepreg : R-1650E |
|
|
|
![]() LED lightings |
High thermal conductive glass composite circuit board materials | ![]() Double-sided : R-1787 |
|
|
|
![]() Automotive Power module |
High thermal conductive Bonding sheet | R-14T1 |
|
|
|
![]() Mobile products |
Flexible circuit board materials | ![]() series |
We meet the diverse mounting needs of mobile products such as smartphones and digital appliances | ||
![]() Mobile products |
Flexible circuit board materials | ![]() R-F775 |
|
|
|
![]() ![]() Mobile products Automotive |
LCP flexible circuit board materials | ![]() Double-sided copper clad : R-F705S |
|
|
|
![]() Mobile products |
Low transmission loss flexible multi-layer circuit board materials | Low Dk bonding sheet : R-BM17 Core : R-F705 |
|
|
|
![]() Mobile products |
Flexible circuit board materials resin coated copper foil | ![]() Material for thinner, multilayed : R-FR10 |
|
|
|
![]() ![]() Automotive Mobile products |
Halogen-free multi-layer circuit board materials | ![]() series |
Lineup of environment-friendly materials corresponding to the various application of mobile products. | ||
![]() ![]() Automotive Mobile products |
Halogen-free multi-layer circuit board materials | ![]() Laminate : R-1566, R-1566(W) R-1566(WN) Prepreg : R-1551, R-1551(W) R-1551(WN) |
|
|
|
![]() Automotive |
High heat resistance halogen-free multi-layer circuit board materials | ![]() Laminate : R-1566S Prepreg : R-1551S |
|
|
|
![]() ![]() Automotive Industry |
High CTI, High RTI Halogen-free multi-layer circuit board materials | ![]() Laminate : R-3566D Prepreg : R-3551D |
|
|
|
![]() ![]() Mobile products Automotive |
Low Dk halogen-free multi-layer circuit board materials | ![]() Laminate : R-A555(W) Prepreg : R-A550(W) |
|
|
|
![]() Automotive, etc. (many applications) |
Multi-layer circuit board materials | Laminate : R-1766 Prepreg : R-1661 |
|
|
|
![]() ![]() Automotive Mobile products, etc. (many applications) |
Mass laminations(Shield board) | ![]() |
|
|
|
![]() ![]() Automotive Appliance |
High reliability Glass composite circuit board materials | Double-sided copper clad : R-1785 |
|
|
|
![]() ![]() Appliance Antenna |
Glass composite circuit board materials | Double-sided copper clad : R-1786 Single-sided copper clad : R-1781 |
|
|
|
![]() Appliance High current applications |
Thick copper glass composite circuit board materials | Double-sided copper clad : R-1786 |
|
|
|
![]() ![]() Appliance LED lightings |
Paper phenolic circuit board materials | Single-sided copper clad : R-8700 |
|
|