- Possible to make board thinner and simplify the build-up process. Contribute to thinner and smaller of mobile product and module.
- Excellent moldability realizes 3-layer flexible circuit boards with smoother surface layers.
Circuit Board Materials
- Part Number
R-FR10
- Application
- Detailed use
・Mobile
Smartphone(Main/Sub board, Module board), Etc.
Properties
Thinned multi-layer
Simplify the build-up process
Good coplanarity
Concept
R-FR10 enables thinner, multi-layered circuit boards and simplified manufacturing processes.
Thin multi-layer
Thinning of rigid flex is possible.
Surface smoothness
Surface smoothness after molding
General properties
| Item | Test method | Condition | Unit | FELIOS FRCC R-FR10 |
|
|---|---|---|---|---|---|
| Glass transition temp.(Tg) | Internal method(DMA) | A | °C | 70,210(Ad) / 320(PI) | |
| Internal method(TMA) | A | °C | 190(Ad) / 270(PI) | ||
| CTE x, y-axis | α1 | Internal method(TMA) | A | ppm/°C | 80(Ad) / 25(PI) |
| α2 | 580(Ad) / 25(PI) | ||||
| CTE z-axis | α1 | Internal method(TMA) | A | ppm/°C | 210(Ad) / - (PI) |
| α2 | 210(Ad) / - (PI) | ||||
| Dielectric constant(Dk) | 1GHz | IPC-TM-650 2.5.5.9 | A | － | 3.0(Ad) / 3.3(PI) |
| 2GHz | 3.0(Ad) / 3.2(PI) | ||||
| Dissipation factor(Df) | 1GHz | 0.019(Ad) / 0.010(PI) | |||
| 2GHz | 0.020(Ad) / 0.010(PI) | ||||
| Solder heat resistance | JIS C 6481 | A | － | No abnormality | |
| 260°C solder float for 1min. | |||||
| Peel strength | Copper:0.012mm(12μm) | JIS C 6481 | A | N/mm | 0.8 |
| Volume resistivity | JIS C 6481 | C-96/20/65 | MΩ·m | 1×108 | |
| C-96/20/65+C-96/40/90 | 9×107 | ||||
| Surface resistance | JIS C 6481 | C-96/20/65 | MΩ | 3×108 | |
| C-96/20/65+C-96/40/90 | 1×108 | ||||
| Water absorption | Internal method | E-24/50+D-24/23 | % | 1.2 | |
| Flammability | UL | A and E-168/70 | － | 94VTM-0*1 | |
| Alkali resistance | Internal method | Dipping 3minutes in 3%NaOH at 40°C | － | No abnormality | |
| Elastic modulus | Internal method | C-24/23/50 | GPa | 1.0(Ad) / 4.0(PI) | |
| Bending property | MIT*2 method | 0.5kgφ0.38, 175cpm, 135° | times | >150 | |
The sample thickness is Copper12μｍ, PI3μm, Ad17μm.
*1 Measured by R-FR10/R-F775 25μm/R-FR10 construction
*2 Measured 18μm ED copper on R-F775 25μm covered by R-FR10 for both side
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
