February 3, 2025
Partial Withdrawal Third-Party Certification for Electronic Materials |
January 29, 2025
Price Revision of Flexible Circuit Board Materials |
November 1, 2024
Investigation Results on Quality Irregularities by the External Investigation Committee and Endeavors Taken at PID |
October 31, 2024
Update of Part Number List of Irregularities in Third-party Certification |
September 6, 2024
Update of Part Number List of Irregularities in Third-party Certification |
July 25, 2024
Price Revision of Circuit Board Materials |
July 1, 2024
Partial withdrawal of third-party certification registration from electronic materials |
June 3, 2024
Partial withdrawal of third-party certification registration from electronic materials |
May 22, 2024
Update of Part Number List of Irregularities in Third-party Certification |
May 20, 2024
Withdrawal of Certifications of International Standard for Quality Management Systems, IATF 16949 |
Apr 26, 2024
Update of Part Number List of Irregularities in Third-party Certification |
Apr 12, 2024
Update of Part Number List of Irregularities in Third-party Certification |
Mar 22, 2024
Withdrawal of Certifications of International Standard for Quality Management Systems, ISO 9001 |
Mar 15, 2024
Part Number List of Irregularities in Third-party Certification |
Mar 15, 2024
Identification of irregularities in additional part numbers and an additional factory in third-party certification |
Feb 7, 2024
Temporary Suspension of Certifications of International Standard for Quality Management Systems, IATF 16949 |
Feb 2, 2024
Temporary Suspension of Certifications of International Standard for Quality Management Systems, ISO 9001 |
Jan 12, 2024
Irregularities in third-party certification of electronic materials and establishment of the external investigation committee |
Oct 12, 2023
Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment |
May 15, 2023
Panasonic Industry Develops High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards |
Mar 16, 2023
Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments |
Aug 30, 2022
Price Revision on Semiconductor Encapsulation Materials |
Aug 25, 2022
Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development with JAXA |
June 22, 2022
Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications |
Jan 18, 2022
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment |
Nov 10, 2021
Price Revision on Semiconductor Encapsulation Materials |
Aug 6, 2021
Introduction of New Material For Next Generation Display Development TOUGHTELON |
Jun 22, 2021
Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability |
Mar 2, 2021
Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement |
Feb 25, 2021
Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas |
May 19, 2020
Exhibition information: ECTC 2020 Virtual Conference |
Jan 7, 2020
Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020” |
Oct 18, 2019
Current damage report and recovery status at Panasonic Koriyama plant due to Typhoon Hagibis |
Jan 21, 2019
Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment |
Dec 21, 2018
Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019 |
Dec 13, 2018
Panasonic to Bolster Substrate Material Business for Semiconductor Packages and Modules in China and North East Asian Region |
Sep 3, 2018
Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics |
Aug 29, 2018
Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP |
Jun 4, 2018
Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability |
May 29, 2018
Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules |
Mar 9, 2018
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations |
Feb 8, 2018
Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai |
Jan 11, 2018
Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas |
Jun 1, 2017
Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations |
May 12, 2017
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations |
Feb 3, 2017
Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts |
Jan 17, 2017
Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials |
Dec 27, 2016
Price Revision for Copper clad Laminates and Mass Laminations |
Dec 22, 2016
Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use |
Aug 25, 2016
Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels |
May 30, 2016
Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage |
May 26, 2016
Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates" |
Apr 5, 2016
Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP |
Mar 18, 2016
Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages |
Mar 3, 2016
Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires |
February 27 ,2012
 Announcing the release of the thermosetting plastic molding-materials“Full Bright”used for LED reflectors |