Electronic Materials TOP Products Downloads Exhibition News About us Location February 3, 2025Partial Withdrawal Third-Party Certification for Electronic Materials January 29, 2025Price Revision of Flexible Circuit Board Materials November 1, 2024Investigation Results on Quality Irregularities by the External Investigation Committee and Endeavors Taken at PID October 31, 2024Update of Part Number List of Irregularities in Third-party Certification September 6, 2024Update of Part Number List of Irregularities in Third-party Certification July 25, 2024Price Revision of Circuit Board Materials July 1, 2024Partial withdrawal of third-party certification registration from electronic materials June 3, 2024Partial withdrawal of third-party certification registration from electronic materials May 22, 2024Update of Part Number List of Irregularities in Third-party Certification May 20, 2024Withdrawal of Certifications of International Standard for Quality Management Systems, IATF 16949 Apr 26, 2024Update of Part Number List of Irregularities in Third-party Certification Apr 12, 2024Update of Part Number List of Irregularities in Third-party Certification Mar 22, 2024Withdrawal of Certifications of International Standard for Quality Management Systems, ISO 9001 Mar 15, 2024Part Number List of Irregularities in Third-party Certification Mar 15, 2024Identification of irregularities in additional part numbers and an additional factory in third-party certification Feb 7, 2024Temporary Suspension of Certifications of International Standard for Quality Management Systems, IATF 16949 Feb 2, 2024Temporary Suspension of Certifications of International Standard for Quality Management Systems, ISO 9001 Jan 12, 2024Irregularities in third-party certification of electronic materials and establishment of the external investigation committee Oct 12, 2023Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment May 15, 2023Panasonic Industry Develops High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards Mar 16, 2023Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments Aug 30, 2022Price Revision on Semiconductor Encapsulation Materials Aug 25, 2022Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development with JAXA June 22, 2022Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications Jan 18, 2022Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment Nov 10, 2021Price Revision on Semiconductor Encapsulation Materials Aug 6, 2021Introduction of New Material For Next Generation Display Development TOUGHTELON Jun 22, 2021Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability Mar 2, 2021Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement Feb 25, 2021Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas May 19, 2020Exhibition information: ECTC 2020 Virtual Conference Jan 7, 2020Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020” Oct 18, 2019Current damage report and recovery status at Panasonic Koriyama plant due to Typhoon Hagibis Jan 21, 2019Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment Dec 21, 2018Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019 Dec 13, 2018Panasonic to Bolster Substrate Material Business for Semiconductor Packages and Modules in China and North East Asian Region Sep 3, 2018Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics Aug 29, 2018Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP Jun 4, 2018Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability May 29, 2018Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules Mar 9, 2018Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations Feb 8, 2018Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai Jan 11, 2018Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas Jun 1, 2017Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations May 12, 2017Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations Feb 3, 2017Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts Jan 17, 2017Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials Dec 27, 2016Price Revision for Copper clad Laminates and Mass Laminations Dec 22, 2016Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use Aug 25, 2016Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels May 30, 2016Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage May 26, 2016Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates" Apr 5, 2016Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP Mar 18, 2016Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages Mar 3, 2016Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires February 27 ,2012Announcing the release of the thermosetting plastic molding-materials“Full Bright”used for LED reflectors
