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Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP | R-F705S

Flexible circuit board materials LCP(Liquid Crystal Polymer) R-F705S

 

  1. Good high-frequency properties make this material suitable for high-speed large-volume data transmission by mobile devices.
  2. R-F705S may be used as a replacement of micro coaxial cable and millimeter-wave radar antenna.

Circuit Board Materials

  •  Part Number 

Double-sided copper clad R-F705S

Halogen-free
  • Application
  • Detailed use
Avionics/Space Wireless Automotive
・Avionics/
 Space
・Wireless
・Anntena
Avionics/Space applications, Smartphone (Antenna module), Laptop, Tablet PC, 4K/8K display (High-speed FPC cable), Automotive component (Millimeter-wave radar), etc.

Electronic Materials

Properties

Dk 2.9  Df 0.002
@14GHz
Water absorption
0.04%
Peel strength
0.8N/mm

Line-up

Supports thick plate specifications due to high board thickness accuracy.

 
Line-up

Concept

Concept

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

General properties

Item Test method Condition Unit R-F705S
Solder heat resistance JIS C 6471 288°C solder float for 1min – No abnormality
Moisture absorption
solder heat resistance		 Internal Method C-96/40/90
260°C solder float for 1min		 – No abnormality
Dielectric constant (Dk) 14GHz Balanced-type
circular disk
resonace		 A – 2.9
Dissipation factor (Df) 0.002
Dielectric constant (Dk) 10GHz Cavity
resonance		 A – 3.3
Dissipation factor (Df) 0.002
Tensile modulus ASTM D882 A GPa 3.5
Surface resistivity JIS C 6471 A MΩ 4.0×1010
Water absorption Internal Method 25°C 50h immersion % 0.04
Peel strength
ED:18μm		 IPC-TM-650
2.4.8		 A N/mm 0.8
260℃ solder float for 5sec
Chemical resistance JIS C 6471 HCl 2mol/l 23°C 5min – No abnormality
NaOH 2mol/l 23°C 5min
IPA 23°C 5min
Dimensional stability IPC-TM-650
2.2.4		 After etching MD % 0.008
After etching TD 0.007
After E-0.5/150 MD 0.052
After E-0.5/150 TD 0.035
Flammability UL A + E-168/70 – 94VTM-0
  ED (TP4S) 18-100-18

The sample thickness is 0.1mm.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.