- Good high-frequency properties make this material suitable for high-speed large-volume data transmission by mobile devices.
- Excellent dielectric properties when moisture is absorbed. Compatible with an antenna’s circuit boards for millimeter-wave radar that require water resistance and environmental resistance.
Circuit Board Materials
- Part Number
Double-sided
copper clad R-F705S
- Application
- Detailed use
・Aerospace
・Wireless
・Anntena
・Wireless
・Anntena
Avionics/Space applications, Smartphone (Antenna module), Laptop, Tablet PC, 4K/8K display (High-speed FPC cable), Automotive component (Millimeter-wave radar), etc.
Properties
Dk 2.9 Df 0.002
@14GHz
@14GHz
Water absorption
0.04%
0.04%
Peel strength
0.8N/mm
0.8N/mm
Line-up
Supports thick plate specifications due to high board thickness accuracy.
Concept
Contributes to miniaturization and weight reduction of devices by making them thinner than coaxial cables.
Dielectric properties during moisture absorption
R-F705S has lower transmission loss than polyimide products even when absorbing moisture.
General properties
| Item | Test method | Condition | Unit | FELIOS LCP R-F705S |
|
|---|---|---|---|---|---|
| Solder heat resistance | IPC-TM-650 | 288°C solder float for 1min | – | No abnormality | |
| Moisture absorption solder heat resistance |
Internal Method | C-96/40/90 260°C solder float for 1min |
– | No abnormality | |
| Dielectric constant (Dk) | 14GHz | Balanced-type circular disk resonator method |
A | – | 2.9 |
| Dissipation factor (Df) | 0.002 | ||||
| Dielectric constant (Dk) | 10GHz | Cavity resonator method |
A | – | 3.3 |
| Dissipation factor (Df) | 0.002 | ||||
| Tensile modulus | ASTM D882 | A | GPa | 3.5 | |
| Surface resistivity | JIS C 6471 | A | MΩ | 4.0×1010 | |
| Water absorption | Internal Method | 23°C 24hr immersion | % | 0.04 | |
| Peel strength ED:18μm |
IPC-TM-650 | A | N/mm | 0.8 | |
| 260℃ solder float for 5sec | |||||
| Chemical resistance | JIS C 6471 | HCl 2mol/l 23°C 5min | – | No abnormality | |
| NaOH 2mol/l 23°C 5min | |||||
| IPA 23°C 5min | |||||
| Dimensional stability | IPC-TM-650 | After etching MD | % | 0.008 | |
| After etching TD | 0.007 | ||||
| After E-0.5/150 MD | 0.052 | ||||
| After E-0.5/150 TD | 0.035 | ||||
| Outgas | TML / CVCM / WVR* | ASTM E595-07 ASTM E595-15 |
－ | % | 0.05 / <0.01 / 0.04 |
| ED (TP4S) 18-100-18 | |||||
The sample thickness is 0.1mm.
* TML: Total Mass Loss
CVCM: Collected Volatile Condensable Material
WVR: Water Vapor Recovered
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
