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Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7 | R-5785(N), R-5785(GN), R-5785(GE), R-5785(R)

Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7 R-5785(N), R-5785(GN), R-5785(GE), R-5785(R)

 

  1. Due to our industry leading low dielectric constant and dissipation factor, these materials are suitable for high-speed data transmission by servers and routers using high-layercount, large-size PCB designs.

Circuit Board Materials

  • Part Number

Low Dk glass cloth

Laminate R-5785(N)
Prepreg R-5680(N)

Low Dk glass cloth/ Improved processability

Laminate R-5785(GN)
Prepreg R-5680(GN)

Normal glass cloth/ Improved processability

Laminate R-5785(GE)
Prepreg R-5680(GE)

Buried Resistor Copper Foil

Laminate R-5785(R)

  • Application
  • Detailed use
Network
Aerospace
・Network
・Wireless
・Aerospace
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna(Base station, Automotive millimeter-wave radar), Aerospace, Etc.

Electronic Materials

Properties

Dk 3.4 Df 0.002
@12GHz
Tg(DSC)
200°C
T288(with copper)
>120min

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layered

Heat resistance of High Multi-layered

Buried Resistor Copper Foil specification

Buried Resistor Copper Foil specification

General properties

Item Test method Condition Unit MEGTRON7
R-5785(N)
Low Dk
glass cloth		 MEGTRON7
R-5785(GN)
Low Dk
glass cloth		 MEGTRON7
R-5785(GE)
Normal
glass cloth		 MEGTRON7
R-5785(R)
Buried Resistor
Copper Foil		 MEGTRON6
R-5775(N)
Low Dk
glass cloth
Glass transition temp.(Tg) DSC A °C 200 200 200 200 185
CTE z-axis α1 IPC-TM-650
2.4.24		 A ppm/°C 42 42 42 42 45
α2 280 280 280 280 260
T288(with copper) IPC-TM-650
2.4.24.1		 A min >120 >120 >120 >120 >120
Dielectric constant(Dk) 12GHz Balanced-type
circular disk
resonator		 C-24/23/50 － 3.4 3.4 3.6 3.4 3.4
Dissipation factor(Df) 0.002 0.002 0.003 0.002 0.004
Peel strength*¹ 1oz(35μm) IPC-TM-650
2.4.8		 A kN/m 0.8 0.8 0.8 0.8*² 0.8

The sample thickness is 0.75mm.
*1 R-5785(GN), R-5785(GE): H-VLP2 Copper, R-5785(N), R-5775(N): H-VLP Copper
*2 Buried Resistor Copper Foil 1/2oz (18μm)

The above data are typical values and not guaranteed values.