Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8 | R-5795(U), R-5795(N)

Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8 | R-5795(U), R-5795(N)

 

  1. The new materials support 800GbE used for next-generation high-speed communication technology.
  2. Comparison of MEGTRON8 R-5795(U) and MEGTRON7 R-5785(N), improving transmission loss by about 30% (@28GHz) and contributing to improvement in the signal processing performance of high-speed communication networking equipment.

Circuit Board Materials

  • Part Number

Ultra-low Df glass cloth type

Laminate R-5795(U)
Prepreg R-5690(U)

Low Dk glass cloth type

Laminate R-5795(N)
Prepreg R-5690(N)

  • Application
  • Detailed use
Network
Wireless
・Network
・Wireless
Routers, Switches, Optical Transmission Equipment, Servers, AI Servers, Base Stations, Semiconductor Test Equipment, Probe Cards, etc.

Properties

Dk 3.1 Df 0.0012
@14GHz
Tg(DMA)
220°C
T288(with copper)
>120min

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by transmission loss

Frequency dependence by transmission loss

General properties

Item Test method Condition Unit MEGTRON8
R-5795(U)
Ultra-low Df
glass cloth
MEGTRON8
R-5795(N)
Low Dk
glass cloth
MEGTRON7
R-5785(N)
Low Dk
glass cloth
Glass transition temp.(Tg) DMA A °C 220 220 200
CTE z-axis α1 IPC-TM-650
2.4.24
A ppm/°C 50 50 45
α2 270 270 320
T288(with copper) IPC-TM-650
2.4.24.1
A min >120 >120 >120
Dielectric constant(Dk) 14GHz Balanced-type
circular disk
resonator
C-24/23/50 3.1 3.1 3.2
Dissipation factor(Df) 0.0012 0.0016 0.0021
Peel strength 1oz(35μm) IPC-TM-650
2.4.8
A kN/m 0.7
[H-VLP3]
0.7
[H-VLP3]
0.8
[H-VLP]

The sample thickness is 0.75mm.
The sample structure is #1078 x 10 ply.

The above data are typical values and not guaranteed values.