Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type> HIPER V | R-1755V

Highly heat resistant Low CTE Multi-layer circuit board materials High-Tg type HIPER V R-1755V

 

  1. Good for hybrid board with MEGTRON series. Standard loss material.

Circuit Board Materials

  • Part Number

Laminate R-1755V
Prepreg R-1650V

  • Application
  • Detailed use
Network
・Network
ICT infrastructure equipment, Measuring instrument, Etc.

Properties

Dk 4.4 Df 0.016
@1GHz
Tg(DSC)
173°C
T288(with copper)
20min

IST(Interconnect Stress Test)

IST(Interconnect Stress Test)

Solder heat resistance(float)

Solder heat resistance(float)

General properties

Item Test method Condition Unit HIPER V
R-1755V
Glass transition temp(Tg) DSC A °C 173
CTE z-axis α1 IPC TM-650 2.4.24 A ppm/°C 44
α2 255
T288(with copper) IPC TM-650 2.4.24.1 A min 20
Dielectric constant(Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 4.4
Dissipation factor(Df) 0.016
Peel strength 1oz(35μm) IPC TM-650 2.4.8 A kN/m 1.5

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.

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