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Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
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Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
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Semiconductor Device Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
플라스틱 성형재료
Plastic Molding Compound for LED "FULL BRIGHT" series
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
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Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Other New Materials
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series : Models
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Parts no
Product status
New (0)
Active (3)
NRFND (0)
Series/Type
HIPER D High heat resistance (High-Tg) multi-layer circuit board materials (1)
HIPER E High heat resistance multi-layer circuit board materials HIPER E (1)
HIPER M High heat resistance (Middle-Tg) multi-layer circuit board materials (1)
재설정
Glass transition temp.(Tg) :DSC (°C)
-
133 (1)
153 (1)
163 (1)
재설정
Glass transition temp.(Tg) :TMA (°C)
-
133 (1)
150 (1)
154 (1)
재설정
Glass transition temp.(Tg) :DMA (°C)
-
153 (1)
175 (1)
185 (1)
재설정
Thermal decomposition temp.(Td):TGA (°C)
-
345 (1)
355 (1)
370 (1)
재설정
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min)
110 (1)
>120 (1)
- (1)
재설정
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min)
15 (1)
18 (1)
25 (1)
재설정
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)
10-12 (1)
11-13 (2)
재설정
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)
12-14 (1)
13-15 (2)
재설정
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
40 (1)
42 (1)
43 (1)
재설정
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
236 (1)
240 (1)
250 (1)
재설정
Thermal conductivity:Laser flash,25˚C
- (3)
재설정
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
1 x 109 (3)
재설정
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ)
1 x 108 (3)
재설정
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
5 (2)
- (1)
재설정
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
4.4 (1)
4.6 (2)
재설정
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
- (3)
재설정
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
- (3)
재설정
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
0.013 (1)
0.014 (1)
- (1)
재설정
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
0.013 (1)
0.014 (1)
0.016 (1)
재설정
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
- (3)
재설정
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
- (3)
재설정
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
0.11 (3)
재설정
Flexural modulus,Warp/MD:JIS C 6481
- (3)
재설정
Flexural modulus,Fill/TD:JIS C 6481 (GPa)
21 (1)
22 (2)
재설정
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
1.3 (1)
1.5 (1)
1.6 (1)
재설정
Flammability:UL,C-48/23/50
94V-0 (3)
재설정
The sample thickness
0.8mm (3)
재설정
The above data are typical values and not guaranteed values.
- (3)
재설정
*1 Test method: TMA
- (3)
재설정
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Glass transition temp.(Tg) :DSC
Glass transition temp.(Tg) :TMA
Glass transition temp.(Tg) :DMA
Thermal decomposition temp.(Td):TGA
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Thermal conductivity:Laser flash,25˚C
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Flexural modulus,Warp/MD:JIS C 6481
Flexural modulus,Fill/TD:JIS C 6481
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,C-48/23/50
The sample thickness
The above data are typical values and not guaranteed values.
*1 Test method: TMA
Choice
Parts no
Catalog /
Datasheet
Series/Type
Glass transition temp.(Tg) :DSC
(°C)
Glass transition temp.(Tg) :TMA
(°C)
Glass transition temp.(Tg) :DMA
(°C)
Thermal decomposition temp.(Td):TGA
(°C)
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
(min)
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
(min)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Thermal conductivity:Laser flash,25˚C
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Flexural modulus,Warp/MD:JIS C 6481
Flexural modulus,Fill/TD:JIS C 6481
(GPa)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,C-48/23/50
The sample thickness
The above data are typical values and not guaranteed values.
*1 Test method: TMA
R-1755D
HIPER D High heat resistance (High-Tg) multi-layer circuit board materials
163
154
185
345
-
15
10-12
12-14
43
236
-
1 x 109
1 x 108
-
4.4
-
-
-
0.016
-
-
0.11
-
21
1.3
94V-0
0.8mm
-
-
R-1755E
HIPER E High heat resistance multi-layer circuit board materials HIPER E
133
133
153
370
>120
25
11-13
13-15
42
250
-
1 x 109
1 x 108
5
4.6
-
-
0.013
0.013
-
-
0.11
-
22
1.6
94V-0
0.8mm
-
-
R-1755M
HIPER M High heat resistance (Middle-Tg) multi-layer circuit board materials
153
150
175
355
110
18
11-13
13-15
40
240
-
1 x 109
1 x 108
5
4.6
-
-
0.014
0.014
-
-
0.11
-
22
1.5
94V-0
0.8mm
-
-