- Protection of “brain” of mobile terminal from drop impact
- Underfill/Sidefill reinforcement material when BGA/CSP is mounted
Product features
For secondary mounting reinforcement drop impact resistance liquid encapsulant
- CV5313 CV5314
For IC package
LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.
Comparison of impact test evaluations
Characteristics of main products
| Item | Unit | Underfill CV5313 |
Sidefill CV5314 |
|---|---|---|---|
| Viscosity(25°C) | Pa·s | 2 | 130 |
| Thixotropic index | – | 1.2 | 3.5 |
| Gel time(150°C) | sec | 50 | 70 |
| Recommended curing conditions | 120°C 5min | 120°C 5min | |
| Tg | °C | 105 | 80 |
| α1 | ppm | 70 | 35 |
| Flexural modulus | GPa | 3 | 7 |
The above data is actual values and not guaranteed values.
