High elasticity Low CTE Ultra-thin IC substrate materials | R-151YE, R-1515E

Ultra-thin circuit board materials R-151YE, R-1515E

 

  1. Contribute to thin IC package by ultra-thin material and decrease the substrate warpage by low CTE property

Semiconductor Device Materials

  • Part Number
  • Application
  • Detailed use
IC substrate
・IC substrate
CSP (DRAM, NAND/PMIC, Mini LED, etc.)
FC-CSP (APU, RF-IC, etc.)

New part number

  •  

Laminate R-151YE

Prepreg R-141YE

Existing part number

  •  

Laminate R-1515E

Prepreg R-1410E

  • There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
suffix

Properties

Flexural modulus
25°C 33GPa
CTE x, y-axis
9ppm/°C
Tg (DMA)
270°C

Package warpage(FBGA)

Package warpage(FBGA)

Thermal expansion (x-axis)

Thermal expansion (x-axis)

General properties

ItemTest methodConditionUnit    LEXCM GX    
R-151YE
R-1515E
Glass transition temp.(Tg)DMA*²A°C270
Thermal decomposition temp.(Td)TGAA°C390
CTE x-axis  α1  Internal methodAppm/°C9
CTE y-axis9
CTE z-axis  α1  IPC-TM-650 2.4.24A22*¹
  α2  95*¹
Flexural modulusJIS C 648125°CGPa33*¹
250°C18*¹

The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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