- Contribute to thin IC package by ultra-thin material and decrease the substrate warpage by low CTE property
Circuit Board Materials
- Part Number
Laminate R-1515E
Prepreg R-1410E
- Application
IC substrate
New branding announcement
- Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Properties
Flexural modulus
25°C 33GPa
25°C 33GPa
CTE x, y-axis
8-10ppm/°C
8-10ppm/°C
Tg (DMA)
270°C
270°C
Package warpage(FBGA)
Thermal expansion(x-axis)
General properties
| Item | Test method | Condition | Unit | LEXCM GX R-1515E |
|
|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA*2 | A | °C | 270 | |
| Thermal decomposition temp.(Td) | TGA | A | °C | 390 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 8-10 |
| CTE y-axis | 8-10 | ||||
| CTE z-axis*1 | α1 | IPC-TM-650 2.4.24 | A | 22 | |
| α2 | 95 | ||||
| Flexural modulus*1 | JIS C 6481 | 25°C | GPa | 33 | |
| 250°C | 18 | ||||
The sample thickness is 0.1mm.
*1 0.8mm
*2 Measurement in tensile mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
