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Capacitors
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Aluminum Electrolytic Capacitors (Radial Lead Type)
Backup Power Supply Modules with Electric Double Layer Capacitors
Electric Double Layer Capacitors (Multilayer Coin Type) (Discontinued products)
Electric Double Layer Capacitors (Wound Type)(Discontinued products)
Film Capacitors (Electronic Equipment Use)
Film Capacitors (AC Motor Use)
Film Capacitors (Automotive, Industrial and Infrastructure Use)
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Power Inductors for Automotive application
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Voltage Step-up Coils(Discontinued products)
Multilayer type Power Inductors (Discontinued products)
Choke Coils (Discontinued products)
Chip Inductors (Discontinued products)
Other Inductor (Coil) products
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Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM)
NTC Thermistor (Chip type)
Circuit Board Materials for LED lightings "ECOOL" series
Cooling Fan with Unique Hydro Dynamic Bearing
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EMI Filters (Discontinued products)
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6DoF Inertial Sensor for Automotive (6in1 Sensor)
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PS Pressure Sensors
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MA Motion Sensor(Discontinued products)
1-axis accelerometer GF1(Discontinued products)
Light Sensor NaPiCa (Discontinued products)
GS2 Acceleration Sensor (Discontinued products)
GS1 Acceleration Sensor (Discontinued products)
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Motors for FA & Industrial Application（AC Servo Motors/Drivers,Brushless Motors/Amplifiers,Compact AC Geared Motors)
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UN38.3 Test Summary (for Lithium batteries)
Electronic Materials
●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
High heat resistance Phenolic Molding Compound for Automotive Components
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Functional films for HUD cover
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Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
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Thermosetting stretchable film BEYOLEX
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AMTETRA
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AMTECLEAN A
AMTECLEAN Z
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Conductive Polymer Hybrid Aluminum Electrolytic Capacitors : Models
