Outline of Electronic Materials Business Division

Business Policy

Mission

For the changing world, 
we provide people with better lives
and a future with dreams through our material solutions.

Vision

We will continue to be a value-creating group 
solving social issues through material innovation.

Slogan

Partnering to go beyond.

Company profile

Company NamePanasonic Industry Co., Ltd. Electronic Materials Business Division
DirectorHideyuki Hounoki
Address1006,Kadoma,Osaka 571-8506,Japan(Google Map
Products
  • Circuit Board Materials
  • Semiconductor Device Materials
  • Plastic Molding Compounds
  • Advanced Films

Introducing Sites

Japan

Tokyo
  • Headquarters
  • Sales/Marketing
  • R & D
  • Marketing & Sales Coordination Department
  • Production Engineering and Technology Center
Osaka
  • Headquarters
  • Sales/Marketing
  • R & D
  • Marketing & Sales Coordination Department
  • Production Engineering and Technology Center
  • Advanced Material SBU
  • Quality & Environment Center
  • Planning Center
Koriyama Factory
  • Manufacturing
  • LAB
  • R & D
  • Multilayer Circuit Board Materials
Koriyama Plant (West Factory)
  • Manufacturing
  • Multilayer Circuit Board Materials
Yokkaichi Factory
  • Manufacturing
  • R & D
  • Molding Materials
Yokkaichi South Factory
  • Manufacturing
  • LAB
  • R & D
  • Glass Composite Circuit Board Materials
  • Flexible Circuit Board Materials
  • Encapsulation Materials
  • Advanced Films
Nagoya
  • Marketing & Sales Coordination Department

Other Global/Overseas Sites

Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd 
China R & D Center for Electronic Materials 
China Electronic Materials R & M Group
  • Manufacturing
  • R & D
  • Marketing
  • Multilayer Circuit Board Materials
Panasonic Industrial Devices Materials (Suzhou) Co., Ltd.
  • Manufacturing
  • Multilayer Circuit Board Materials
  • Glass Composite Circuit Board Material
Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.
  • Manufacturing
  • Molding Materials
  • Encapsulation Materials
Panasonic Panasonic Industrial Devices Materials Taiwan Co., Ltd. 
Taiwan Semiconductor Materials R & D Center
  • Manufacturing
  • Sales/Marketing
  • R & D
  • Multilayer Circuit Board Materials
[Kingdom of Thailand ] 
Panasonic Manufacturing Ayutthaya Co., Ltd.
  • Manufacturing
  • Sales/Marketing
  • Paper Phenolic Circuit Board Materials
  • Molding Materials
  • Encapsulation Materials
[The Republic of Singapore] 
Electronic Materials South Asia R & D Center
  • R & D
  • Encapsulation Materials
[Republik Österreich] 
Panasonic Industrial Devices Materials Europe GmbH 
Electronic Materials European R & M Group
  • Manufacturing
  • Sales/Marketing
  • Multilayer Circuit Board Materials
[The United States of America] 
Panasonic Industrial Devices Sales Company of America 
Electronic Materials American R & M Group
  • Sales/Marketing
We also have sales bases in Hong Kong and Korea.

History

1918-1929

Business foundation

(The origin of the molding materials is the Attachment Plug produced by molding technology called “Nerimono” upon the establishment of Matsushita.Plastic business development period)

1930-1945

Plastic business development

(Production of molding materials commenced for thermosetting resins such as phenolic resin.)

1946-1959

Business base establishment

1960-1970

Plastic business establishment

Production of laminates, etc. started

  • 1961.Yokkaichi Plant begins operations
  • 1970.Koriyama Plant begins operations
1971-1986

Electronics materials rollout Expanded the business of circuit board materials

1987-1999
  • 1987.South Yokkaichi Plant begins operations
  • 1987.Multi-layer Materials Plant in Taiwan begins operations
  • 1987.Matsushita Electric Works Electronic Materials Sales ,Ltd begins operations
  • 1993.Multi-layer Materials Plant in U.S begins operations
  • 1994.Molding compounds & Encapsulation materials for semiconductors Plant in Ayuthaya, Thailand begins operations
  • 1995.Paper CCL & PCB Plant in Suzhou, China begins operations (Paper CCL production ended in 2011)
  • 1996.Launched “MEGTRON” brand
  • 1996.Paper CCL Plant in Ayutthaya, Thailand begins operations
  • 1999.Multi-layer Materials Plant in Guangzhou,China begins operations 
2000
  • 2000.Establishes Panasonic Electric Works Electronic Materials Europe GmbH 2001.Koriyama West Plant begins operations
  • 2002.Molding compounds Plant in Shanghai, China begins operations
  • 2005.Encapsulation materials for semiconductors Plant in Shanghai, China begins operations
  • 2005.Establishes Koriyama MEW, Establishes Yokkaichi MEW (Merger with Panasonic Corporation in 2017)
  • 2005.Advanced films Plant in Koriyama begins operations
  • 2005.Multi-layer Materials production ended in U.S
  • 2006.Multi-layer Materials Plant in Suzhou, China begins operations 
2010
  • 2011.Glass composite Materials Plant in Suzhou, China begins operations
  • 2013.Establishes Electronic Materials China R&D center
  • 2019.Establishes Taiwan Semiconductor Materials R&D center
  • 2021.Launched “LEXCM” brand
  • 2022.Launched “XPEDION” brand
  • 2022.Establishes Panasonic Industry Co., Ltd.