For secondary mounting reinforcement drop impact resistance liquid encapsulant | CV5313, CV5314

For secondary mounting reinforcement drop impact resistance liquid encapsulant

 

  1. Protection of “brain” of mobile terminal from drop impact
  2. Underfill/Sidefill reinforcement material when BGA/CSP is mounted

Product features

For secondary mounting reinforcement drop impact resistance liquid encapsulant

ECOM Fine Flow
  • CV5313 CV5314

For IC package

LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.

Comparison of impact test evaluations

Comparison of impact test evaluations

Characteristics of main products

Item Unit Underfill
CV5313
Sidefill
CV5314
Viscosity(25°C) Pa·s 2 130
Thixotropic index 1.2 3.5
Gel time(150°C) sec 50 70
Recommended curing conditions   120°C 5min 120°C 5min
Tg °C 105 80
α1 ppm 70 35
Flexural modulus GPa 3 7

The above data is actual values and not guaranteed values.

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