- Protection of “brain” of mobile terminal from drop impact
- Underfill/Sidefill reinforcement material when BGA/CSP is mounted
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5313 CV5314
- Application
- Detailed use
・Package
・Mobile
・Mobile
LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.
Properties
Drop impact resistance
Underfill reinforcement
Sidefill reinforcement
Comparison of impact test evaluations
Characteristics of main products
| Item | Unit | Underfill CV5313 |
Sidefill CV5314 |
|---|---|---|---|
| Viscosity(25°C) | Pa⋅s | 2 | 130 |
| Thixotropic index | – | 1.2 | 3.5 |
| Gel time(150°C) | sec | 50 | 70 |
| Recommended curing conditions | – | 120°C 5min | 120°C 5min |
| Tg | °C | 105 | 80 |
| α1 | ppm | 70 | 35 |
| Flexural modulus | GPa | 3 | 7 |
The written property values are just an example of our product line-up. Please contact us for details.
