Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6 | R-5775(N), R-5775(K), R-5775(G), R-5775(S), R-5775(R)

Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6 R-5775(N), R-5775(K), R-5775(G), R-5775(S), R-5775(R)

 

  1. The industry standard for high speed, ultra-low loss PCB material.
  2. Excellent HDI and thermal performance.

Circuit Board Materials

  • Part Number

Low Dk glass cloth

Laminate R-5775(N)
Prepreg R-5670(N)

Normal glass cloth

Laminate R-5775(K)
Prepreg R-5670(K)

 

Laminate R-5775(G)
Prepreg R-5670(G)

Buried Resistor Copper Foil

Low Dk glass cloth

Laminate R-5775(S)

Normal glass cloth

Laminate R-5775(R)

  • Application
  • Detailed use
Network
Aerospace
・Network
・Wireless
・Aerospace
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna(Base station, Automotive millimeter-wave radar), Aerospace, Etc.

Properties

Dk 3.34 Df 0.0037
@13GHz
Tg(DSC)
185°C
T288(with copper)
>120min

Video

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layered

Heat resistance of High Multi-layered

Dielectric property

Dielectric property

Buried Resistor Copper Foil specification

Buried Resistor Copper Foil specification

General properties

Item Test method Condition Unit MEGTRON6
R-5775(N)
 Low Dk glass cloth 
MEGTRON6
R-5775(K)/R-5775(G)
Normal glass cloth
Glass transition temp.(Tg) DSC A °C 185 185
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 45 45
α2 260 260
T288(with copper) IPC-TM-650 2.4.24.1 A min >120 >120
Dielectric constant(Dk) 13GHz Balanced-type
circular disk resonator
C-24/23/50 3.34 3.62
Dissipation factor(Df) 0.0037 0.0046
Peel strength* 1oz(35μm) IPC-TM-650 2.4.8 A kN/m 0.8 0.8

The sample thickness is 0.75mm.
* H-VLP Copper

The above data are typical values and not guaranteed values.