- Supporting thermal dissipation from PCB material that good for thermal conductivity property and processability because its resin board.
Circuit Board Materials
- Part Number
Double-sided copper clad R-1787
- Application
- Detailed use
・Appliance
LED lighting, LED-related equipment, Power supply application, Etc.
Properties
Thermal conductivity
1.1W/m·K
1.1W/m·K
CTI≥600V
Excellent processability
LED thermal simulation
General properties
| Item | Test method | Condition | Unit | ECOOL R-1787 |
Conventional CEM-3 R-1786 |
|
|---|---|---|---|---|---|---|
| Thermal conductivity | Laser flash | A | W/m·K | 1.10 | 0.45 | |
| Glass transition temp.(Tg) | TMA | Temp. rising rate:10°C/min | °C | 140 | 140 | |
| Solder heat resistance | JIS C 6481 | 260°C solder float for 2min | － | No abnormality | No abnormality | |
| Heat resistance | 1oz | JIS C 6481 | A | － | 230°C 60min | 240°C 60min |
| Tracking resistance | IEC 60112 | A | V | CTI≥600 | CTI≥600 | |
| Dielectric constant (Dk) | 1MHz | JIS C 6481 | C-96/20/65 | － | 4.7 | 4.2 |
| C-96/20/65+D-24/23 | － | 4.7 | 4.2 | |||
| 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | － | 4.5 | 4.0 | |
| Dissipation factor (Df) | 1MHz | JIS C 6481 | C-96/20/65 | － | 0.010 | 0.011 |
| C-96/20/65+D-24/23 | － | 0.010 | 0.011 | |||
| 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | － | 0.009 | 0.007 | |
| Insulation resistance | JIS C 6481 | C-96/20/65 | MΩ | 1x10⁸ | 5x10⁸ | |
| Flat-withstand voltage | ASTM D149 | A | KV/mm | 43 | 49 | |
The sample thickness is 1.6mm.
The above data are typical values and not guaranteed values.
