2.Ultra Small, Low Profile Package MOSFET

Panasonic’s CSP MOSFETs in Ultra Small, Low Profile Package

Resin Sealed PKG

Resin Sealed PKG

2.0 x 2.0mm
4.0mm2

43% miniaturization

CSP

CSP

1.5 x 1.5mm
2.3mm2

Resin sealed PKG

0.4mm

75% thinner

CSP

0.1mm

*Comparison of Panasonic parts with same on resistance rating

Use case

Suitable for small or thin form factor applications

Suitable for small appliances such as earphones, slim equipment such as bankcard.

Earphones

Earphones

Smart card

Smart card

Wearable

Wearable

MOSFET for General Switching