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Please select Capacitors - Conductive Polymer Electrolytic Capacitors - - Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) - - Conductive Polymer Tantalum Solid Capacitors (POSCAP) - - Conductive Polymer Aluminum Solid Capacitors (OS-CON) - - Conductive Polymer Hybrid Aluminum Electrolytic Capacitors - Aluminum Electrolytic Capacitors - - Conductive Polymer Aluminum Solid Capacitors (OS-CON) - - Conductive Polymer Hybrid Aluminum Electrolytic Capacitors - - Aluminum Electrolytic Capacitors (Surface Mount Type) - - Aluminum Electrolytic Capacitors (Radial Lead Type) - Electric Double Layer Capacitors (Gold Capacitor) - - Backup Power Supply Modules with Electric Double Layer Capacitors - - Electric Double Layer Capacitors (Multilayer Coin Type) (Discontinued products) - - Electric Double Layer Capacitors (Wound Type) (Discontinued products) - Film Capacitors - - Film Capacitors (Electronic Equipment Use) - - Film Capacitors (AC Motor Use) - - Film Capacitors (Automotive, Industrial and Infrastructure Use) Resistors - Chip Resistors - - High Temperature Chip Resistors - - High Precision Chip Resistors - - Current Sensing Chip Resistors - - Small & High Power Chip Resistors - - Anti-Sulfurated Chip Resistors - - General Purpose Chip Resistors - - Resistor Network - Other Resistors - - Attenuator - - Leaded Resistors (Discontinued products) - - Thermal Sensitive Resistors (Discontinued products) - - Trimmer Potentiometers (Discontinued products) Inductors (Coils) - Power Inductors for Automotive application - Power Inductors for Consumer - Voltage Step-up Coils - Multilayer type Power Inductors (Discontinued products) - Choke Coils (Discontinued products) - Chip Inductors (Discontinued products) Thermal Management Solutions - Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM) - NTC Thermistor (Chip type) - Cooling Fan with Unique Hydro Dynamic Bearing - Circuit Board Materials - - Circuit Board Materials for LED lightings "ECOOL" series EMC Components, Circuit Protection - EMC Components (Common mode Noise Filters, Shield Film) - - Common mode Noise Filters - - Electromagnetic Wave Shield Film - - EMI Filters (Discontinued products) - Circuit Protection (ESD, Surge, Fuse etc.) - - ESD Suppressor - - Chip Varistor - - Varistors (ZNR Surge Absorber) - - Fuses Sensors - Sensors - - MR Sensor - - 6DoF Inertial Sensor for Automotive (6in1 Sensor) - - Gyro Sensors - - Temperature Sensors (Automotive use) - Built-in Sensors - - Infrared Array Sensor Grid-EYE - - PS-A Pressure Sensors (built-in amplification and temperature compensating circuit) - - PS Pressure Sensors - - PF Pressure Sensors - - PM2.5 Sensors - - PIR Motion Sensor PaPIRs - - MA Motion Sensor (Discontinued products) - - 1-axis accelerometer GF1 (Discontinued products) - - Light Sensor NaPiCa (Discontinued products) - - GS2 Acceleration Sensor (Discontinued products) - - GS1 Acceleration Sensor (Discontinued products) - FA Sensors Input Devices, Switches - Switches - - Detector Switches - - Push Switches - - Tactile Switches (Light Touch Switches) - - Power Rocker Switches - - Seal Type Switches - - Non Seal Type Switches - - Limit Switches - - Snap Switches - - Fall Detection Switches - Force Sensing Capacitive Device - - Force Sensing Capacitive Device - Encoders, Potentiometers - - Encoders - - Automotive Encoders - - Rotary Potentiometers - - Automotive Rotary Potentiometers - - Position Sensors - Touch Panels Semiconductors Relays, Connectors - Relays / Couplers - - PhotoMOS - - Power Relays (Over 2A) - - Safety Relays - - Solid State Relays (SSR) - - Signal Relays (2A or less) - - Microwave Devices (Microwave Relays/Coaxial Switches) - - Automotive Relays - - High-capacity DC Cutoff Relays - - PhotoIC Coupler - - Interface Terminal - Connectors - - Narrow Pitch Connector for board to FPC - - Narrow Pitch Connector for board to board - - High Current Connectors - - FPC/FFC Connectors - - Active Optical Connectors FA Sensors & Components - FA Sensors - - Fiber Sensors - - Light Curtains / Safety Components - - Area Sensors - - Photoelectric Sensors / Laser Sensors - - Micro Photoelectric Sensors - - Inductive Proximity Sensors - - Pressure Sensors / Flow Sensors - - Measurement Sensors - - Particular Use Sensors - - Sensor Options - - Wire-Saving Systems - FA Devices - - Static Control Devices - - Energy Management Solutions - - Programmable Controllers / Interface Terminal - - Human Machine Interface - - Machine Vision Systems - - UV-Curing Systems - - Laser Markers / 2D Code Readers - - Timers / Counters / FA Components Motors, Compressors - Motors for FA & Industrial Application - - AC Servo Motors / Drivers - - Brushless Motors / Amplifiers - - Compact AC Geared Motors - Motors for Facility/Home appliance & Automotive - - Motors for Air Conditioning - - Motors for Vacuum Cleaner - - Motors for Refrigerator - - Motors for Automotive - Compressors - - Reciprocating Compressors (Fixed Speed) - - Reciprocating Compressors (Variable Speed) - - Rotary Compressors (Fixed Speed) - - Rotary Compressors (Variable Speed) - - Scroll Compressors (Fixed Speed) - - Scroll Compressors (Variable Speed) - DC Pumps Recording Media - Industrial Devices - Recording Media - - Blu-ray Disc™ Custom & Module Devices - Optical Components - - Aspherical Glass Lenses - Custom Devices - - Chip Ring - Module Devices - - Ultrasonic Gas Flow Sensor GB-L1CM1 Factory Automation, Welding Machines - FA - - Electronic Component Mounting-related Systems - - Solution items - - Device-related Systems - - Display-related Systems - - Measuring system - - Final Assembly Test and Packing - Welding Machines, Industrial Robots - - Arc Welding Machines - - Industrial Robots - - Laser Processing - FA Devices Batteries (for Business) - Secondary Batteries (Rechargeable Batteries) - - Lithium-ion Batteries - - Nickel Metal Hydride Batteries - - Coin-type Rechargeable Lithium Batteries - - Pin-type Lithium-ion Batteries - Primary Batteries - - Lithium Batteries - - Zinc Carbon and Alkaline Batteries Electronic Materials - Circuit Board Materials - - High frequency circuit board materials for wireless/RF applications "XPEDION"series - Semiconductor Device Materials - - Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series - - Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series - - Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series - Plastic Molding Compound - - Plastic Molding Compound for LED "FULL BRIGHT" series - - High heat resistance Phenolic Molding Compound for Automotive Components - - Long-term reliable PBT Molding Compound for Automotive Components - - Urea molding compounds - - Melamine molding compounds - Advanced Films - - Advanced Functional Films for Automotive Applications - - Sensor films for large-screen touch panel - Other New Materials - - Thermosetting stretchable film BEYOLEX Materials - Pana-Tetra Zinc Oxide Single Crystal - Pana-Tetra Compound Resin - Pana-Tetra Electrification Prevention Film - "AMTECLEAN A" Cleaning Agent for Injection Molding Machines - "AMTECLEAN Z" Inorganic Antimicrobial Agent - - 32bit Inverter Control MN103H - - 32bit Inverter Control MN103S - - 32bit Low Power MN103L - - 8bit Low Power MN101E - - 8bit Low Power MN101C - - 8bit Ultra Low Power MN101L - - Arm® Cortex®-M7 MCUs MN1M7 - - Human Machine Interface Display LSIs - - Audio Integrated LSIs - - NFC Tag LSIs - - NFC Tag Modules - - Secure IC - - LED Driver ICs for Lighting - - LED Driver ICs for Amusements - - LED Driver ICs for Illumination - - Stepping Motor Driver ICs - - 3-Phase Brushless DC Motor Driver ICs - - 1-Phase Brushless DC Motor Driver ICs - - Brushed DC Motor Driver ICs (Discontinued products) - - Lens Driver ICs for camcorder and camera - - MOSFETs for Lithium-ion Battery Protection - - MOSFETs for General Switching - - MOSFETs for Automotive Cell Balancing - - MOSFETs for Automotive Switching Circuit - - Other MOSFETs - - White LEDs (Discontinued products) - - Surface-mount LEDs (Discontinued products) - - Lamp LEDs (Discontinued products) - - Ambient Light Sensors (Discontinued products) - - Front Monitors (Discontinued products) - - Remote Control Receivers (Discontinued products) - - IrDAs (Discontinued products) - - Red and Infrared (IR) Dual Wavelength Laser Diodes - - Red Laser Diodes (Discontinued products) - - Infrared (IR) Laser Diodes (Discontinued products) - - Image Sensors for Security, Industry and Medical Use - - Image Sensors for Broadcasting and Digital Still Camera - - 3D Sensing Solution (ToF) - - Low Noise Amplifiers (LNA) - - Power Amplifier for Handsets (PA) (Discontinued products) - - GaN Power Devices (Discontinued products) - - AC-DC converter / Power supply IC (IPD) - - DC-DC Module with built-in Inductor (PSiP) (Discontinued products) - - DC-DC Regulators with built-in MOS (Discontinued products) - - DC-DC Regulator for Car-AV and Industry - - Battery Monitoring IC - - Epoxy Resin Insulation Sheet Materials "ECOM Fine Sheet" - LED Lighting Connectors - - Thermoelectric Cooling Roller

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2023

• Mar
  16
  Information
  Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments

2022

• Jun
  22
  Information
  Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications

2021

• Jun
  22
  New product
  Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
• Mar
  2
  New product
  Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

2018

• Dec
  13
  To Bolster Substrate Material Business in North East Asian Region
• Sep
  3
  Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
• Aug
  29
  Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
• May
  29
  Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
• Mar
  9
  Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
• Feb
  8
  Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai

2017

• May
  12
  Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
• Feb
  3
  Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts

2016

• Dec
  27
  Price Revision for Copper clad Laminates and Mass Laminations
• Aug
  25
  Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
• May
  30
  Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
• May
  26
  Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
• Mar
  18
  Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
• Mar
  3
  Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires

2015

• Oct
  1
  Panasonic Commercializes High Heat-Resistant Semiconductor Encapsulation Material for Power Devices

2013

• Oct
  1
  Panasonic Establishes Electronic Materials South Asia R&D Center in Singapore