Highly heat resistant Halogen-free Multi-layer circuit board materials | R-1566S

Highly heat resistant Halogen-free Multi-layer circuit board materials R-1566(S)

 

  1. Added highly heat resistant and tracking resistance to automotive quality R-1566 to improve the reliability of ECU boards used under severe conditions.

Circuit Board Materials

  • Part Number

Laminate R-1566S
Prepreg R-1551S

Halogen-free
  • Application
  • Detailed use
Automotive
・Automotive
Automotive ECU, Automotive module, HEV/EV power control unit, DC/DC converter board, etc.

Properties

Tg (DSC)
175°C
Td (TGA)
355°C
CTI≥600V
(actual value)

Positioning of Glass transition temperature(Tg)

Positioning of Glass transition temperature(Tg)

Through-hole reliability

Through-hole reliability

Insulation reliability

Insulation reliability

General properties

Item Test method Condition Unit Halogen-free
R-1566S
Our conventional
Halogen-free
R-1566(W)
Glass transition temp. (Tg) DSC A °C 175 148
TMA 170 145
Thermal decomposition temp. (Td) TGA A °C 355 350
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 40 40
α2 180 180
T288 (with copper) IPC-TM-650 2.4.24.1 A min 10 3
Peel strength 1oz (35µm) IPC-TM-650 2.4.8 A kN/m 1.6 1.8

The sample thickness is 0.8mm.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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