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Secondary mounting reinforcement of semiconductor package
such as CSP/BGA, Adhesive bonding of camera module/image sensor
such as CSP/BGA, Adhesive bonding of camera module/image sensor
Semiconductor Encapsulation Materials/Adhesive
- High heat resistance Secondary mounting Sidefill materials CV5797
- High heat resistance Secondary mounting Underfill materials CV5794
- Low-temperature curing Secondary mounting Underfill materials CV5350AS
- For secondary mounting reinforcement Drop impact resistance liquid encapsulant
CV5313, CV5314 - Thermosetting Adhesive/UV curing Adhesive CV5000, CV7000
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| Application | Our proposal |
|---|---|
| CSP / BGA / Image Sensor WLPCSP / QFN / MLCC, etc  |
High heat resistance Secondary mounting Sidefill materials CV5797 For large size PKG Tg 160°C Pot life 72h Frozen storage Easy to inspect |
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High heat resistance Secondary mounting Underfill materials CV5794 Tg 160°C Pot life 72h Frozen storage |
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Low-temperature curing Secondary mounting Underfill materials CV5350AS Cures at a low temp of 80°C Tg is 150°C or greater High fluidity |
|
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For secondary mounting reinforcement Drop impact resistance liquid encapsulant CV5313, CV5314 Drop impact resistance Underfill/Sidefill reinforcement |
Camera Module |
Thermosetting Adhesive/UV curing Adhesive CV5000, CV7000 Bonding of various materials Solvent resistance Time-lagged curing
|
Surface Mount Assembly Reinforcement Type for PKGs
Necessity of Reinforcement for Automotive Electronic Components (Solder Crack Causes)
