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Secondary mounting reinforcement of semiconductor package
such as CSP/BGA, Adhesive bonding of camera module/image sensor
such as CSP/BGA, Adhesive bonding of camera module/image sensor
Semiconductor Encapsulation Materials/Adhesive
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| Application | Our proposal |
|---|---|
| CSP / BGA / Image Sensor WLPCSP / QFN / MLCC, etc  |
High heat resistance Secondary mounting Sidefill materials For large size PKG Tg 160°C Pot life 72h Frozen storage Easy to inspect |
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High heat resistance Secondary mounting Underfill materials Tg 160°C Pot life 72h Frozen storage |
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Low-temperature curing Secondary mounting Underfill materials Cures at a low temp of 80°C Tg is 150°C or greater High fluidity |
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For secondary mounting reinforcement Drop impact resistance liquid encapsulant Drop impact resistance Underfill/Sidefill reinforcement |
Surface Mount Assembly Reinforcement Type for PKGs
Necessity of Reinforcement for Automotive Electronic Components (Solder Crack Causes)
