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Contribute to improving the reliability of semiconductor package
such as a power device requiring automotive quality
such as a power device requiring automotive quality
Semiconductor Encapsulation Materials
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| Application | Our oroposal |
|---|---|
Power device |
High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG |
|
For Power modules High thermal conductive High heat dissipation Stress reduction High adhesion |
|
|
For high heat resistance power devices High heat resistance Low warpage, Low stress High insulation |
